XC4044XL-2BG352C

The XC4044XL-2BG352C is an AMD XC4000E/X Field Programmable Gate Array (FPGA) delivered in a 352‑LBGA exposed pad metal package. It integrates programmable logic, on‑chip RAM and a high I/O count for commercial embedded designs.

With approximately 3,800 logic elements, 51,200 bits of embedded RAM and 289 user I/Os, the device operates from 3.0 V to 3.6 V and is rated for commercial temperatures from 0 °C to 85 °C, making it suitable for a range of mid‑complexity digital applications.

Key Features

• Core Logic  Approximately 3,800 logic elements for implementing combinational and sequential logic functions.
• On‑Chip Memory  Approximately 51,200 bits of embedded RAM for small buffers, FIFOs and state storage.
• I/O Density  289 user I/O pins to interface with peripherals, buses and external devices.
• Logic Capacity  Equivalent to 44,000 gates to support mid‑level logic integration.
• Package & Mounting  352‑LBGA exposed pad, metal package (supplier device package: 352‑MBGA 35×35) with surface‑mount mounting.
• Power  Voltage supply range of 3.0 V to 3.6 V.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental  RoHS compliant.

Typical Applications

• Embedded Control & Glue Logic  Implement custom control logic and board‑level interfacing where reconfigurable logic is required.
• I/O Expansion & Peripheral Bridging  High I/O count supports bridging between multiple peripherals, buses and external devices without extensive external glue.
• On‑board Buffering & Data Handling  On‑chip RAM provides localized buffering and small data storage for state machines and FIFOs.
• Prototyping & Custom Logic  Programmable fabric suitable for prototyping and production designs that require reconfigurable logic resources.

Unique Advantages

• High I/O Count:  289 user I/Os reduce reliance on external expanders and simplify system interconnects.
• Integrated Memory:  51,200 bits of embedded RAM enable on‑chip buffering and reduce the need for external memory in many use cases.
• Moderate Logic Capacity:  Approximately 3,800 logic elements and 44,000 equivalent gates provide the resources needed for mid‑complexity designs.
• Compact BGA Package:  352‑LBGA exposed pad metal package supports compact PCB layouts and surface‑mount assembly.
• Commercial Temperature Rating:  0 °C to 85 °C operation aligns with standard commercial embedded deployments.
• Manufacturer Backing:  Part of AMD’s XC4000E/X FPGA family, providing continuity for designs using this series.

Why Choose XC4044XL-2BG352C?

The XC4044XL-2BG352C delivers a balanced combination of programmable logic, on‑chip RAM and a high number of I/Os in a compact 352‑LBGA package. Its specification set—approximately 3,800 logic elements, 51,200 bits of embedded RAM, 289 I/Os, and a 3.0–3.6 V supply—suits designers who need mid‑range logic capacity and substantial external connectivity for commercial embedded systems.

This device is well suited for teams implementing custom glue logic, peripheral bridging, small buffering tasks and prototyping where a reconfigurable FPGA fabric with integrated memory and a dense I/O count is required. Backed by AMD’s XC4000E/X series pedigree, it offers a straightforward option for designs that prioritize integration and compact packaging.

Request a quote or submit an inquiry to begin procurement or to evaluate XC4044XL-2BG352C for your next design.