XC4044XL-2BG352I

The XC4044XL-2BG352I is a field programmable gate array (FPGA) IC from AMD in the XC4000E/X family, supplied in a 352-LBGA exposed pad metal package. It targets applications requiring a moderate logic capacity with on-chip memory and a broad I/O complement in a surface-mount, industrial-grade form factor.

Key device attributes include approximately 3,800 logic elements, 51,200 bits of embedded RAM, 289 I/O pins, and a 3.0 V to 3.6 V supply range. The device supports industrial operating temperatures from −40 °C to 100 °C and is RoHS compliant.

Key Features

• Core / Logic Capacity  Approximately 3,800 logic elements and 1,600 CLBs provide mid-range logic resources for custom digital functions and control logic.
• Embedded Memory  51,200 bits of on-chip RAM (approximately 0.051 Mbits) for local storage, buffering, and state machines.
• I/O and Gate Count  289 general-purpose I/O pins and an estimated 44,000 gates to support complex interfacing and gate-level integration within system designs.
• Package and Mounting  352-LBGA exposed pad metal package (supplier device package: 352-MBGA, 35×35) intended for surface-mount assembly and thermal management via the exposed pad.
• Power  Operates from a 3.0 V to 3.6 V supply range, suitable for standard 3 V-class system power domains.
• Temperature Range  Industrial-grade operating range from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

• Balanced logic and memory resources: The combination of ~3,800 logic elements and 51,200 bits of RAM enables efficient implementation of mid-complexity digital functions without external memory for many designs.
• High I/O count: 289 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and dense peripheral connectivity, reducing the need for additional interface ICs.
• Industrial temperature capability: Rated from −40 °C to 100 °C to address applications that require extended operating temperature margins.
• Robust packaging for thermal handling: The 352-LBGA exposed pad metal package supports surface-mount assembly and improved heat dissipation for sustained operation.
• Standard 3 V supply compatibility: Operates on a 3.0 V to 3.6 V supply, aligning with common system power rails for straightforward integration.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing processes and regulatory requirements.

Why Choose XC4044XL-2BG352I?

The XC4044XL-2BG352I positions itself as a mid-capacity FPGA solution from AMD that combines a practical balance of logic, embedded memory, and a large I/O count in a thermally conscious LBGA package. Its industrial temperature rating and surface-mount 352-LBGA form factor make it suitable for designs that require robustness and integration in constrained board footprints.

Designers and procurement teams seeking a RoHS-compliant FPGA with moderate gate density, ample I/O, and on-chip RAM will find this part appropriate for control, interface, and custom logic functions that operate on standard 3 V power domains and across wide temperature ranges.

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