XC4044XL-3HQ304I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 256 51200 3800 304-BFQFP Exposed Pad |
|---|---|
| Quantity | 183 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 304-PQFP (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 304-BFQFP Exposed Pad | Number of I/O | 256 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1600 | Number of Logic Elements/Cells | 3800 | ||
| Number of Gates | 44000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200 |
Overview of XC4044XL-3HQ304I – XC4000E/X Field Programmable Gate Array IC, 256 I/O, 304-BFQFP Exposed Pad
The XC4044XL-3HQ304I is a field programmable gate array (FPGA) from the XC4000E/X family designed for embedded logic implementations requiring moderate gate density and a high I/O count. It provides approximately 3,800 logic elements, around 51,200 bits of on-chip RAM and 256 user I/O, making it suitable for I/O‑intensive and control-oriented designs.
Built for industrial environments, this surface-mount device supports a 3.0 V to 3.6 V supply and an operating temperature range of −40 °C to 100 °C, and is furnished in a 304‑pin BFQFP package with an exposed pad for thermal performance.
Key Features
- Core Logic Approximately 3,800 logic elements provide the programmable fabric for implementing custom state machines, glue logic and medium-complexity digital functions.
- On‑Chip Memory Approximately 51,200 bits of embedded RAM to support buffering, small lookup tables and local storage without external memory.
- I/O Density 256 user I/O pins to support multiple peripherals, wide buses or parallel interfaces directly on-chip.
- Gate Count Specified at 44,000 gates to give a practical measure of available logic resources for integration and partitioning.
- Power Supply Supports a 3.0 V to 3.6 V supply range, compatible with standard 3.3 V systems.
- Package & Mounting 304‑pin BFQFP with exposed pad (304‑PQFP 40×40) in a surface-mount form factor for robust thermal and board-level integration.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- RoHS Compliant Conforms to RoHS environmental requirements.
Typical Applications
- Industrial Control Systems Use the device’s industrial temperature rating and 256 I/O for sensor interfacing, actuator control and real‑time logic in factory automation.
- Protocol Bridging and I/O Expansion Leverage the high I/O count to implement parallel buses, protocol translators or multi‑channel interfaces on a single FPGA.
- Embedded Logic and Glue Deploy the 3,800 logic elements and on‑chip RAM for custom glue logic, timing adaptation and small data buffering within embedded platforms.
Unique Advantages
- High I/O Capacity: 256 user I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi-signal designs.
- Integrated Memory: Approximately 51,200 bits of on-chip RAM enable local buffering and lookup tables, lowering external memory dependency.
- Industrial‑Grade Temperature Range: Specified −40 °C to 100 °C operation supports deployment in harsh and temperature‑variable environments.
- Standard 3.3 V Compatibility: 3.0 V to 3.6 V supply range aligns with common 3.3 V logic domains for straightforward system integration.
- Thermally Aware Package: 304‑pin BFQFP with exposed pad facilitates thermal conduction for improved board-level thermal design.
- RoHS Compliance: Meets RoHS requirements for environmentally conscious designs.
Why Choose XC4044XL-3HQ304I?
The XC4044XL-3HQ304I delivers a balanced combination of logic capacity, embedded memory and a high I/O count in a thermally capable 304‑pin BFQFP package. Its specifications make it well suited to engineers designing industrial and I/O‑centric systems that require reliable operation across a wide temperature range.
This FPGA is an option for projects that need moderate gate density, local RAM and abundant I/O without moving to larger, more complex devices. The device’s supply and packaging characteristics support straightforward integration into existing 3.3 V designs while meeting RoHS requirements.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for the XC4044XL-3HQ304I.

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