XC4052XL-09BG432C

The XC4052XL-09BG432C is a commercial-grade XC4000E/X field programmable gate array in a 432-LBGA exposed-pad package from AMD. It delivers a balanced mix of logic capacity, on-chip memory and I/O density for embedded designs that require moderate logic resources in a compact surface-mount package.

Typical use cases include embedded control, protocol processing and I/O-rich interface tasks where a 3.0–3.6 V supply and 0 °C to 85 °C operating range meet system requirements.

Key Features

• Core Logic  Approximately 4,598 logic elements and about 52,000 gates provide the programmable logic resources needed for combinational and sequential logic implementation.
• Embedded Memory  Approximately 61,952 bits of on-chip RAM to implement FIFOs, small buffers and state storage without external memory.
• I/O Capacity  352 user I/O pins enable high pin-count interfacing for bus bridging, peripheral aggregation and multi-channel I/O designs.
• Power  Supports a single supply range from 3.0 V to 3.6 V for straightforward power system integration.
• Package & Mounting  432-LBGA exposed-pad, metal package (supplier device package: 432-MBGA, 40×40) in a surface-mount form factor for compact board layouts and thermal coupling.
• Operating Range  Commercial operating temperature from 0 °C to 85 °C for typical consumer and commercial electronics environments.
• Environmental Compliance  RoHS compliant, helping meet environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Embedded Control  Implement custom control logic, state machines and glue logic for embedded systems in compact consumer and commercial products.
• Interface Bridging  Use the high I/O count to aggregate and translate between multiple interfaces or buses in communications and connectivity modules.
• Signal Conditioning & Processing  Leverage on-chip RAM and logic elements for buffering, simple packet handling and protocol preprocessing tasks.
• Prototyping & Development  Suitable for evaluating mid-range FPGA partitioning and validating system-level designs prior to further scale-up.

Unique Advantages

• Balanced logic and memory: Approximately 4,598 logic elements paired with ~61,952 bits of embedded RAM offers a practical balance for mid-complexity designs without external memory overhead.
• High I/O density: 352 I/O pins provide flexibility to handle multiple peripherals and interfaces directly from the FPGA device.
• Compact BGA footprint: The 432-LBGA exposed-pad package supports a space-efficient board layout while aiding thermal dissipation through the exposed pad.
• Simplified power integration: Single-supply operation from 3.0 V to 3.6 V aligns with common system rails for easier power design.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, matching requirements for a wide range of consumer and commercial applications.
• RoHS compliant: Meets lead-free assembly requirements for environmentally conscious manufacturing.

Why Choose XC4052XL-09BG432C?

The XC4052XL-09BG432C positions itself as a practical, commercially graded FPGA option for engineers needing a mid-range programmable device with substantial I/O capability and on-chip memory. Its combination of approximately 4,598 logic elements, ~61,952 bits of RAM and 352 I/O pins in a compact 432-LBGA package makes it suitable for embedded control, interface bridging and mid-complexity signal processing tasks.

Manufactured by AMD and provided in a surface-mount, exposed-pad metal package, this device offers designers a reliable, RoHS-compliant building block when a commercial-grade FPGA with defined supply and temperature ranges is required.

Request a quote or submit a pricing inquiry today to discuss availability and delivery for XC4052XL-09BG432C.