XC4052XL-1BG560C

The XC4052XL-1BG560C is a field programmable gate array (FPGA) from the XC4000E/X family, supplied in a 560-ball BGA package with an exposed metal pad. It provides a balance of on-chip logic, memory and I/O capacity for commercial-grade designs that operate from a 3 V to 3.6 V supply and within a 0 °C to 85 °C operating range.

Key on-chip resources include 4,598 logic elements, approximately 61,952 bits of embedded RAM and 352 user I/O pins, enabling integration of multiple digital functions into a single device footprint.

Key Features

• Core Capacity  4,598 logic elements and an estimated 52,000-gate equivalent provide the device’s combinational and sequential implementation capability.
• Embedded Memory  Approximately 61,952 bits of on-chip RAM for local buffering, state storage and small data structures.
• I/O Density  352 user I/O pins to support parallel interfaces, bus connections and general-purpose signaling.
• Package & Mounting  560-LBGA exposed pad, metal package (supplier device package listed as 560-MBGA, 42.5 × 42.5) for surface-mount PCB assembly and thermal conduction through the exposed pad.
• Power & Voltage  Designed for 3 V to 3.6 V supply operation to match common commercial power domains.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial-environment applications.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Compact, high-density logic: 4,598 logic elements and ~52,000 gate equivalence allow consolidation of logic that would otherwise require multiple discrete devices.
• Substantial I/O count: 352 I/O pins support complex external interfacing without extensive board-level multiplexing.
• On-chip RAM for local buffering: Approximately 61,952 bits of embedded memory reduce external memory needs for small buffers and state retention.
• Thermally aware BGA package: 560-ball BGA with exposed metal pad provides a robust surface-mount form factor and an interface for board-level thermal conduction.
• Commercial-grade supply and temperature compatibility: 3 V–3.6 V operation and 0 °C–85 °C rating align with standard commercial system requirements.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assembly processes.

Why Choose XC4052XL-1BG560C?

The XC4052XL-1BG560C positions itself as a commercially graded FPGA option that combines several thousand logic elements, a substantial I/O complement and on-chip RAM in a single BGA package. Its power and temperature specifications make it appropriate for commercial electronic designs that require moderate logic density and significant external interfacing.

This device is suitable for engineering teams seeking to consolidate digital functions, reduce board-level component count, and maintain compliance with RoHS directives while working within a 3 V–3.6 V power envelope and a 0 °C–85 °C operating window.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC4052XL-1BG560C.