XC4052XL-2BG432C

The XC4052XL-2BG432C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD, packaged in a 432‑ball L‑BGA with an exposed metal pad. It provides mid-range programmable logic resources and a high I/O count for embedded and digital designs that require configurable logic, on-chip RAM, and flexible interfacing.

With support for a 3.0–3.6 V supply and an operating range of 0 °C to 85 °C, this device is intended for commercial applications that benefit from significant I/O capacity and a compact BGA package.

Key Features

• Logic Capacity  Approximately 4,598 logic elements suitable for implementing custom digital functions and control logic.
• Configurable Logic Blocks  1,936 CLBs provide the fabric for combinational and sequential logic implementation.
• On‑Chip Memory  Approximately 61,952 bits of embedded RAM available for buffering, FIFOs, and small data stores.
• Gate Count  Around 52,000 gates for medium‑complexity digital designs.
• I/O Density  352 user I/O pins to support multiple interfaces and peripheral connectivity.
• Power  Operates from a 3.0 V to 3.6 V supply range for compatibility with common commercial voltage domains.
• Package & Mounting  432‑LBGA with exposed pad (metal) in a 432‑MBGA (40 × 40) footprint; surface‑mount assembly.
• Temperature Rating  Commercial operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant for lead‑free assembly processes.

Typical Applications

• Custom Digital Logic  Implement glue logic, protocol conversions, and application‑specific processing using the device’s logic elements and CLBs.
• Interface Bridging  Leverage 352 I/O pins to connect multiple peripherals and translate between digital interfaces.
• Embedded System Prototyping  Use on‑chip RAM and programmable logic to validate and iterate embedded control and signal‑processing functions.
• Peripheral and User Interface Control  Drive and coordinate multiple external devices and user interfaces from a compact BGA package.

Unique Advantages

• High logic integration: The device’s ~4,598 logic elements and 52,000 gates enable implementation of medium‑complexity systems without discrete logic.
• Substantial I/O count: 352 I/O pins provide flexibility for multi‑interface designs and direct peripheral connections.
• Embedded RAM for buffering: About 61,952 bits of on‑chip memory support local data storage and short‑term buffering needs.
• Compact BGA package with exposed pad: The 432‑LBGA (40 × 40) footprint with exposed metal pad aids thermal conduction and saves board area.
• Commercial temperature and voltage compatibility: 0 °C to 85 °C operating range and 3.0–3.6 V supply make the device suitable for standard commercial embedded environments.
• RoHS compliant: Facilitates lead‑free manufacturing and regulatory alignment for commercial electronics.

Why Choose XC4052XL-2BG432C?

The XC4052XL-2BG432C offers a balanced combination of programmable logic capacity, on‑chip memory, and a high I/O count in a compact 432‑pin L‑BGA package. As a commercial‑grade FPGA from AMD, it is positioned for designers who need mid‑range programmable resources and flexible interfacing in space‑constrained board designs.

This device is well suited for engineers building embedded systems, interface controllers, and prototype designs where a reliable, RoHS‑compliant FPGA with defined voltage and temperature ranges is required.

Request a quote or submit a procurement inquiry to check pricing and availability for the XC4052XL-2BG432C.