XC4052XL-2BG432I

The XC4052XL-2BG432I is an AMD XC4000E/X series field programmable gate array (FPGA) in a 432-LBGA exposed pad metal package. It provides a balance of on-chip logic, embedded RAM and I/O density for designs that require reprogrammable logic and flexible interfacing.

Key electrical and environmental characteristics include a 3.0 V to 3.6 V supply range, industrial operating temperature from −40 °C to 100 °C, and RoHS compliance, making the device suitable for industrial-grade electronic designs.

Key Features

• Logic Capacity  Approximately 4,598 logic elements delivering reprogrammable combinational and sequential resources for custom logic implementation.
• Embedded Memory  Approximately 61,952 bits of on-chip RAM to support local buffering, small FIFOs, and state storage within the FPGA fabric.
• I/O Density  Up to 352 general-purpose I/O pins to support multiple interfaces and parallel connections to peripherals and external logic.
• Logic Blocks  1,936 logic array blocks reported for mapping and partitioning of user designs across the device fabric.
• Gate Equivalent  Approximately 52,000 gates of logic capacity for architectural planning and resource budgeting.
• Power  Nominal supply operation from 3.0 V to 3.6 V for systems designed around standard 3 V-class rails.
• Package and Mounting  432-LBGA exposed pad, metal package (supplier package: 432-MBGA 40 × 40) optimized for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Regulatory Status  RoHS compliant for lead-free assembly processes.

Typical Applications

• Industrial Control  Programmable logic and robust temperature rating make this FPGA suitable for control, monitoring, and automation functions in industrial equipment.
• I/O-Intensive Systems  High pin count (352 I/O) supports applications that require multiple parallel interfaces, sensor arrays, or extensive peripheral connectivity.
• Logic Consolidation  Approximately 4,598 logic elements allow consolidation of multiple discrete logic functions into a single reprogrammable device to reduce board-level component count.
• Embedded Memory Dependent Designs  On-chip RAM (≈61,952 bits) supports local buffering and control-state storage for embedded control and timing applications.

Unique Advantages

• Balanced Logic and Memory  Combines thousands of logic elements with embedded RAM to implement mixed control and data-path functions on a single device.
• High I/O Count  352 I/O pins let designers interface directly to many peripherals without additional I/O expanders, simplifying board-level design.
• Industrial-Rated Operation  Rated from −40 °C to 100 °C to support deployments in harsh or variable-temperature environments.
• Surface-Mount LBGA Package  432-LBGA exposed pad (metal) package provides a compact footprint with thermal conduction paths suitable for assembled systems.
• Wide 3 V Supply Range  Operates across a 3.0 V to 3.6 V supply window to fit standard 3 V-class system rails.
• Regulatory Compatibility  RoHS compliance supports modern lead-free manufacturing processes.

Why Choose XC4052XL-2BG432I?

The XC4052XL-2BG432I positions itself as a flexible, industrial-grade FPGA that brings together several thousand logic elements, modest embedded RAM, and a high I/O count in a compact 432-LBGA package. Its electrical and thermal specifications make it suitable for designers seeking reprogrammable logic with broad interfacing capability and industrial temperature tolerance.

This device is well suited to engineering teams consolidating discrete logic, implementing custom control functions, or building I/O-dense systems where RoHS compliance and a defined 3.0–3.6 V operating range are important. The combination of logic resources, I/O, and packaging supports scalable designs and long-term deployment in demanding environments.

Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for the XC4052XL-2BG432I.