XC4052XL-2BG560C

The XC4052XL-2BG560C is an AMD XC4000E/X series field programmable gate array (FPGA) supplied in a 560-ball LBGA package with exposed pad. It provides a commercial-grade, surface-mount programmable logic solution with a balance of logic density, on-chip memory and I/O for embedded designs.

Designed for commercial embedded applications, the device offers reprogrammable logic capacity and integration that support a range of mid-density logic implementations while meeting RoHS requirements.

Key Features

• Logic Capacity  Approximately 4,598 logic elements providing the programmable fabric for implementing custom logic and state machines.
• Embedded Memory  Approximately 61,952 bits (≈62 Kbits) of on-chip RAM to support data buffering, FIFOs and small embedded storage needs.
• I/O Count  352 user I/O pins to accommodate multiple parallel interfaces and external device connections without excessive external glue logic.
• Gate Equivalent  Approximately 52,000 gates for sizing and partitioning designs at a system level.
• Power and Supply  Operates from a 3.0 V to 3.6 V supply range suitable for common commercial power rails.
• Package and Mounting  560-LBGA exposed pad, metal package (supplier device package: 560-MBGA, 42.5 × 42.5 mm) in a surface-mount format for compact PCB implementations.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, targeting standard commercial environments.
• Regulatory  RoHS compliant.

Unique Advantages

• Moderate logic density: The device’s ~4,598 logic elements and ~52,000 gate equivalence let designers implement complex glue logic and mid-range state machines without external CPLDs.
• Generous I/O availability: 352 I/Os reduce the need for additional interface components and simplify board-level routing for multi-channel systems.
• On-chip memory presence: ~61,952 bits of embedded RAM enable local buffering and small lookup tables, minimizing dependencies on external memory for many control tasks.
• Surface-mount LBGA packaging: The 560-LBGA (42.5 × 42.5 mm) package supports dense PCB layouts while the exposed pad aids thermal conduction in typical commercial assemblies.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and 3.0–3.6 V supply, the part aligns with standard commercial electronics power and thermal expectations.
• RoHS compliance: Facilitates designs that meet common environmental and regulatory requirements.

Why Choose XC4052XL-2BG560C?

The XC4052XL-2BG560C delivers a practical combination of logic resources, on-chip RAM and a high I/O count in a compact 560-LBGA surface-mount package suitable for commercial embedded designs. Its specified voltage range, operating temperature and RoHS compliance make it a straightforward choice when selecting a reprogrammable logic device for mid-density applications.

Engineers and procurement teams will find the part well-suited to projects that require reconfigurable logic, moderate embedded memory and broad external connectivity, while retaining the programmatic flexibility inherent to FPGA-based designs.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC4052XL-2BG560C.