XC4052XL-3BG432C

The XC4052XL-3BG432C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD in the XC4000E/X family. It combines mid-range logic capacity with on-chip embedded memory and a high I/O count in a compact 432-ball LBGA package.

With 4,598 logic elements, approximately 61,952 bits of embedded memory, and 352 user I/O pins, this surface-mount FPGA is intended for designers requiring substantial programmable logic and I/O density within a 3.0–3.6 V operating range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity  Provides 4,598 logic elements and a device-level equivalent of approximately 52,000 gates for mid-range programmable logic implementations.
• Embedded Memory  Approximately 61,952 bits of on-chip RAM to support local buffering, state machines, and small data storage needs without external memory.
• I/O Resources  352 general-purpose I/O pins to support high-density connectivity and multiple interface requirements.
• Power  Designed for a 3.0 V to 3.6 V supply range to match common system power rails.
• Package & Mounting  432-ball LBGA exposed pad, metal package (supplier package listed as 432-MBGA, 40×40); surface-mount for PCB assembly.
• Operating Conditions  Commercial-grade specification with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Custom Logic and Control  Implement state machines, glue logic, and protocol bridging where ~4,600 logic elements and on-chip memory meet design needs.
• I/O-Intensive Interfaces  Support systems that require many external connections—up to 352 I/Os—for sensor arrays, parallel buses, or multiple peripheral interfaces.
• Embedded Processing Support  Provide local buffering and control logic using the device’s ~62kbits of embedded RAM to offload simple processing tasks from a microcontroller.

Unique Advantages

• High Integration: Combines thousands of logic elements, embedded memory, and hundreds of I/Os in a single FPGA to reduce board-level component count and simplify system design.
• Compact Package: 432-ball LBGA with exposed pad delivers a dense footprint and thermal path suitable for space-constrained PCBs.
• Broad I/O Capacity: 352 I/O pins enable complex interconnects without external I/O expanders, helping lower BOM and improve signal routing flexibility.
• Conservative Power Range: 3.0–3.6 V supply compatibility eases integration into systems using standard supply rails.
• Regulatory Compliance: RoHS compliance supports environmental requirements and simplifies regulatory considerations.

Why Choose XC4052XL-3BG432C?

The XC4052XL-3BG432C positions itself as a practical mid-range FPGA choice for designs that need a balance of logic capacity, embedded memory, and high I/O count within a commercial temperature range. Its 432-ball LBGA package and surface-mount form factor suit compact PCBs while the RoHS compliance addresses environmental requirements.

This device is appropriate for engineering teams building custom logic, I/O-heavy subsystems, or embedded control functions that fit within its specified power and temperature envelope. Backed by AMD’s XC4000E/X family lineage, it offers a defined feature set for stable, repeatable integration into production designs.

Request a quote or submit a request for pricing and availability to move your design forward with the XC4052XL-3BG432C.