XC4052XL-3BG432I

The XC4052XL-3BG432I is a Field Programmable Gate Array (FPGA) device from the XC4000E/X family, offering reprogrammable digital logic resources and on-chip memory in a compact ball-grid array package. Its combination of logic capacity, I/O count and embedded RAM makes it suitable for designs that require configurable logic and significant I/O connectivity.

Specified for industrial operation and RoHS compliant, the device supports a 3.0 V to 3.6 V supply and an operating temperature range from -40 °C to 100 °C, enabling deployment in temperature-demanding environments.

Key Features

• Logic Capacity Approximately 4,598 logic elements providing the programmable fabric for implementing custom digital functions.
• Embedded Memory Approximately 61,952 bits of on-chip RAM to support buffering, state machines and small data storage within the FPGA.
• I/O Resources 352 user I/O pins to support wide external connectivity and interface flexibility for multiple peripherals and buses.
• Gate Equivalent Approximately 52,000 gates of logic equivalence to help estimate integration density for system designs.
• Power and Temperature Supports a voltage supply range of 3.0 V to 3.6 V and an operating temperature range of -40 °C to 100 °C for industrial-grade deployments.
• Package and Mounting 432-LBGA exposed pad, metal package (supplier device package: 432-MBGA, 40 × 40) with surface-mount mounting for compact board-level integration.
• Regulatory Status RoHS compliant, meeting common environmental material requirements.

Typical Applications

• Custom Digital Logic and Prototyping Implement and iterate on custom state machines, control logic, and prototype systems using the device’s reprogrammable logic resources.
• I/O-Intensive Systems Systems requiring large numbers of external interfaces can take advantage of the 352 I/O pins for parallel or multi-channel connectivity.
• Embedded Memory-Dependent Functions Designs that need localized buffering, small FIFOs or lookup tables can utilize approximately 61,952 bits of on-chip RAM.

Unique Advantages

• Substantive Logic Density: Approximately 4,598 logic elements allow designers to implement complex combinational and sequential circuits within a single device, reducing the need for multiple discrete chips.
• Generous I/O Count: 352 I/O pins enable flexible interfacing options and support for multi-channel or parallel peripheral connections without external multiplexing.
• Compact, Surface-Mount Package: The 432-LBGA exposed pad metal package (432-MBGA, 40 × 40) provides a compact footprint and thermal path for board-level integration.
• Industrial Operating Range: Rated from -40 °C to 100 °C and RoHS compliant, making the device appropriate for industrial applications where temperature robustness and environmental compliance are required.
• Single-Supply Compatibility: Operates from 3.0 V to 3.6 V, simplifying power-rail design in systems using common 3.3 V supply domains.

Why Choose XC4052XL-3BG432I?

The XC4052XL-3BG432I balances a meaningful logic element count, on-chip RAM and a high I/O density in a compact 432-LBGA package, making it a strong candidate for industrial designs that need configurable digital logic with substantial external connectivity. Its voltage and temperature specifications align with common 3.3 V systems and industrial thermal requirements.

This device is suitable for engineers and procurement teams seeking a field-programmable solution that provides integration, flexibility and RoHS compliance for mid-scale programmable logic applications. Its packaging and thermal characteristics support reliable board-level implementation in space-constrained designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC4052XL-3BG432I. Our team can assist with lead times and order details to support your project schedule.