XC4052XL-3HQ304I

The XC4052XL-3HQ304I is an AMD XC4000E/X Field Programmable Gate Array (FPGA) offered in a 304-pin BFQFP exposed pad package. It provides a mid-range logic fabric combined with on-chip RAM and a high I/O count for embedded and industrial designs.

With 4,598 logic elements, approximately 61,952 bits of embedded RAM, and support for up to 256 I/O, this device targets designs that require flexible programmable logic, moderate embedded memory, and robust I/O capacity while operating across a wide industrial temperature range.

Key Features

• Core Logic — 4,598 logic elements and 1,936 logic blocks (CLBs) to implement combinational and sequential logic functions.
• Embedded Memory — Approximately 0.062 Mbits (61,952 bits) of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Capacity — Up to 256 user I/O pins to interface with external peripherals, sensors, and buses.
• Gate Count — Equivalent to 52,000 gates for design partitioning and integration of custom logic.
• Power — Operates from a 3.0 V to 3.6 V supply range, enabling compatibility with 3 V-class systems.
• Package & Mounting — 304-BFQFP exposed pad (supplier package: 304-PQFP, 40 × 40 mm) in a surface-mount format for board-level integration and thermal conduction through the exposed pad.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial control and automation — Implement custom control logic and I/O interfacing where operation across −40 °C to 100 °C and up to 256 I/O lines are required.
• Embedded system glue logic — Replace or consolidate discrete logic and medium-complexity sequencers using 4,598 logic elements and on-chip RAM for state and buffering.
• Interface bridging and protocol adaptation — Use the device’s I/O capacity and programmable fabric to implement protocol translators, bus adapters, or parallel-to-serial interfaces.

Unique Advantages

• Balanced logic and memory — Approximately 4,600 logic elements combined with ~62 kbits of RAM provide a practical balance for moderate-complexity designs without unnecessary overhead.
• High I/O count — 256 I/O pins let you connect multiple peripherals or implement wide parallel interfaces directly on the FPGA.
• Industrial temperature rating — −40 °C to 100 °C specification supports deployment in temperature-challenging environments.
• Exposed-pad package for thermal management — The 304-BFQFP exposed pad package facilitates heat dissipation at the board level for more reliable operation under load.
• 3.0–3.6 V supply compatibility — Matches common 3 V-class system rails to simplify power supply design.
• RoHS compliant — Meets environmental directives for lead-free manufacturing and procurement requirements.

Why Choose XC4052XL-3HQ304I?

The XC4052XL-3HQ304I positions itself as a practical FPGA choice for engineers needing moderate logic capacity, embedded RAM, and a high I/O count in an industrial-grade package. Its combination of approximately 4,598 logic elements, ~61,952 bits of on-chip RAM, and 256 I/O pins makes it well suited for consolidating glue logic, implementing interface bridges, and building control logic for industrial applications.

Designed for long-term use in temperature-demanding environments and available in a 304-pin BFQFP exposed-pad surface-mount package, this FPGA delivers a mix of integration, I/O flexibility, and environmental robustness that supports scalable designs and simplified board-level thermal management.

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