XC4062XL-09BG432C

The XC4062XL-09BG432C is a field programmable gate array (FPGA) IC from AMD in the XC4000E/X family. It provides a balance of on-chip logic, embedded RAM and I/O capacity in a compact 432-ball L-BGA package for surface-mount assembly.

With 5,472 logic elements, approximately 73,728 bits of on-chip RAM and 352 I/O pins, this device targets commercial embedded and digital design applications that require moderate logic density and extensive I/O connectivity while operating from a 3.0 V–3.6 V supply.

Key Features

• Core / Logic  5,472 logic elements delivering roughly 62,000 usable gates for implementing custom digital logic and control functions.
• Embedded Memory  Total on-chip RAM of 73,728 bits for distributed data buffering, state storage and small look-up tables.
• I/O Density  352 user I/O pins to support parallel interfaces, multi-channel control and wide bus connectivity.
• Power  Voltage supply range of 3.0 V to 3.6 V for standard commercial power domains.
• Package & Mounting  432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) optimized for surface-mount PCB assembly.
• Operating Range  Commercial-grade operating temperature range from 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Implements custom control logic and glue logic in commercial products where moderate logic capacity and extensive I/O are required.
• Prototyping and Development  Used in design validation and prototype boards to evaluate custom logic architectures leveraging its on-chip RAM and logic resources.
• I/O-Intensive Interfaces  Supports boards and modules that require many parallel or multiplexed I/O channels thanks to its 352 I/O pins.
• Digital Control and Sequencing  Applies to applications requiring deterministic digital sequencing and combinational/registered logic implemented on-chip.

Unique Advantages

• Balanced Logic and Memory: Combines 5,472 logic elements with 73,728 bits of on-chip RAM to support mixed logic and small-data buffering requirements without external memory in many designs.
• High I/O Count: 352 I/O pins enable direct interfacing to multiple peripherals and parallel buses, reducing the need for external I/O expanders.
• Compact, Surface-Mount Package: The 432-LBGA exposed pad metal package (432-MBGA, 40×40) delivers a high pin count in a compact form factor suitable for dense PCB layouts.
• Commercial Temperature Specified: Rated for 0 °C to 85 °C operation to match a wide range of commercial product environments.
• Standard Supply Voltage: Operates from a 3.0 V–3.6 V supply, aligning with common commercial power rails.
• RoHS Compliant: Supports environmentally conscious designs and supply-chain compliance.

Why Choose XC4062XL-09BG432C?

The XC4062XL-09BG432C delivers a practical combination of logic density, embedded RAM and high I/O count in a compact 432-ball L-BGA package for commercial embedded designs. Its specification set suits teams looking to implement custom digital logic, interface-rich modules and prototype systems that require a capable, surface-mount FPGA in standard commercial temperature and voltage domains.

This part is appropriate for engineers and procurement teams seeking a mid-range FPGA option with clear, verifiable specifications for logic elements, on-chip memory, I/O capacity, package type and operating conditions—providing predictable integration into commercial electronics designs.

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