XC4062XL-1BG432I

The XC4062XL-1BG432I is an AMD field programmable gate array (FPGA) provided in a 432-LBGA exposed pad metal package. It offers a mid-range programmable logic fabric with a balance of logic elements, on-chip RAM, and a high I/O count suitable for space-constrained, industrial-grade designs.

With 5,472 logic elements (approximately 62,000 gates), 73,728 bits of on-chip RAM, and up to 352 I/O pins, this device targets applications that require moderate logic capacity, significant I/O connectivity, and operation across a wide temperature and voltage range.

Key Features

• Core Logic 5,472 logic elements and approximately 62,000 gates provide the programmable capacity for implementing custom digital logic and control functions.
• Embedded Memory 73,728 bits of on-chip RAM (approximately 0.074 Mbits) for LUTs, small FIFOs, and buffering needs.
• I/O Density Up to 352 I/O pins to support multiple parallel interfaces, sensor arrays, or extensive peripheral connectivity.
• Power Supply Operates from a 3.0 V to 3.6 V supply range to match common system rails.
• Package & Mounting 432-LBGA exposed pad, metal package (supplier device package: 432-MBGA, 40×40) with surface-mount mounting for compact PCB integration.
• Operating Range & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for temperature-challenging environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Logic and Prototyping Implement medium-complexity custom logic and control systems using the device’s 5,472 logic elements and gate capacity.
• High-Density I/O Interfaces Deploy the 352 I/O pins for designs requiring multiple parallel interfaces, sensor arrays, or extensive external connectivity without added I/O expanders.
• On-Chip Memory Utilization Leverage 73,728 bits of on-chip RAM for small buffers, lookup tables, and local data storage to reduce external memory requirements.

Unique Advantages

• Balanced Logic Capacity: Mid-range logic element count and gate density provide a cost-effective platform for complex yet space-conscious designs.
• High I/O Count: 352 I/O pins minimize the need for additional interface components, simplifying BOM and board layout.
• Compact, Thermally-Conscious Package: The 432-LBGA exposed pad metal package supports dense PCB integration and improved thermal conduction from the device package.
• Industrial Temperature Rating: Specified for −40 °C to 100 °C operation, enabling reliable use in industrial environments.
• Flexible Power Integration: 3.0 V to 3.6 V supply range aligns with common system power architectures.
• Regulatory Compliance: RoHS compliance supports environmentally constrained manufacturing requirements.

Why Choose XC4062XL-1BG432I?

The XC4062XL-1BG432I from AMD combines a practical balance of programmable logic, on-chip RAM, and a high I/O count in a compact 432-LBGA exposed pad package. Its industrial temperature rating and surface-mount package make it suitable for applications that require reliable operation across varying environmental conditions while maintaining a small PCB footprint.

This device is well suited to designers seeking a mid-range FPGA solution that delivers sustained logic capacity, substantial I/O connectivity, and on-chip memory for localized buffering and control tasks. Its specification set supports scalable designs where integration density and temperature robustness are important considerations.

Request a quote or submit a purchase inquiry today to evaluate the XC4062XL-1BG432I for your next design.