XC4062XL-1BG560I

The XC4062XL-1BG560I is an AMD field-programmable gate array (FPGA) in the XC4000E/X family, offered in a 560-ball LBGA exposed pad metal package. It delivers a mid-range programmable logic solution with 5,472 logic elements and a substantial I/O count for demanding embedded and industrial applications.

Designed for industrial environments, this device combines on-chip memory, a high gate count and wide I/O connectivity with a 3.0–3.6 V supply range and an operating temperature range of −40 °C to 100 °C, providing a balance of integration and robustness for system designs.

Key Features

• Logic Capacity  5,472 logic elements and approximately 62,000 gates provide the programmable resources for custom digital logic and glue-logic implementations.
• Embedded Memory  Approximately 0.074 Mbits of on-chip RAM (73,728 total RAM bits) to support FIFOs, small buffers and state storage without external memory.
• I/O Count  384 user I/Os to support wide parallel interfaces, multiple buses or mixed-signal front-end connectivity.
• Package  560-ball LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) in a surface-mount format for compact, board-level integration.
• Power  Operates from a 3.0 V to 3.6 V supply range to align with common system power rails.
• Industrial Grade  Specified operating temperature range of −40 °C to 100 °C and industrial grade designation for use in temperature-challenging environments.
• RoHS Compliant  Manufactured in accordance with RoHS requirements.
• Mounting  Surface-mount device suitable for automated PCB assembly processes.

Typical Applications

• Industrial Control  Utilize the industrial temperature range and high I/O count for control, monitoring and automation interfaces in factory or process systems.
• Custom Logic and Glue Logic  5,472 logic elements and 62,000 gates enable implementation of tailored datapaths, protocol bridging and peripheral control.
• High-Density I/O Systems  With 384 I/Os, the device supports multi-channel interfaces, bus aggregation and parallel sensor or actuator connections.
• Embedded Memory-Dependent Designs  Approximately 73,728 bits of on-chip RAM provide local buffering and small data storage for latency-sensitive functions.

Unique Advantages

• Balanced Logic and Memory  A combination of 5,472 logic elements and embedded RAM allows compact implementation of control logic and local data buffering without excessive external components.
• High I/O Density  384 I/Os reduce the need for external I/O expanders and simplify board-level routing for complex interface requirements.
• Industrial Temperature Range  Rated from −40 °C to 100 °C to support deployments in temperature-challenging environments.
• Compact, Robust Packaging  560-LBGA exposed pad metal package with a 42.5 × 42.5 mm footprint delivers a high-pin-count solution in a surface-mount form factor.
• Flexible Power Integration  3.0–3.6 V supply compatibility aligns with common system rails and simplifies power supply design.
• RoHS Compliance  Facilitates use in regions and products requiring lead-free, environmentally compliant components.

Why Choose XC4062XL-1BG560I?

The XC4062XL-1BG560I positions itself as a practical mid-range FPGA option within the XC4000E/X family, combining moderate logic capacity, embedded memory and a high I/O count in a compact 560-LBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded systems where board space, I/O density and environmental tolerances matter.

This part is appropriate for engineering teams who need a configurable hardware building block that balances integration and environmental resilience while supporting common 3.0–3.6 V system power rails. The device’s on-chip resources help reduce external component count and simplify system-level design trade-offs.

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