XC4062XL-1BG560C

IC FPGA 384 I/O 560MBGA
Part Description

XC4000E/X Field Programmable Gate Array (FPGA) IC 384 73728 5472 560-LBGA Exposed Pad, Metal

Quantity 321 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package560-MBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case560-LBGA Exposed Pad, MetalNumber of I/O384Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2304Number of Logic Elements/Cells5472
Number of Gates62000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC4062XL-1BG560C – XC4000E/X Field Programmable Gate Array (FPGA) IC, 384 I/O, 5472 logic elements, 560-LBGA

The XC4062XL-1BG560C is a Field Programmable Gate Array (FPGA) IC from AMD's XC4000E/X family. It provides 5,472 logic elements, approximately 73,728 bits of on-chip RAM, and 384 I/O in a compact 560-LBGA exposed pad package.

This device operates from a 3 V to 3.6 V supply and is specified for commercial temperature operation (0 °C to 85 °C), making it suitable for a wide range of standard embedded designs requiring programmable logic, moderate memory, and a high I/O count.

Key Features

  • Core / Logic Capacity 5,472 logic elements provide a substantial programmable fabric for implementing digital logic and custom functions.
  • Embedded Memory Approximately 73,728 bits of on-chip RAM support local storage and buffering for implemented logic.
  • I/O Density 384 general-purpose I/O pins enable extensive external interfacing and system connectivity.
  • Gate Equivalent Equivalent to 62,000 gates, offering a clear metric for overall logic complexity and integration.
  • Power and Voltage Single-supply operation from 3 V to 3.6 V simplifies power design for compatible systems.
  • Package 560-LBGA exposed pad, metal package (supplier package: 560-MBGA, 42.5 × 42.5 mm) provides a high-density footprint for board-level integration.
  • Mounting and Grade Surface-mount device with commercial temperature grade (0 °C to 85 °C) for standard electronics environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic integration: 5,472 logic elements and 62,000-gate equivalence enable consolidation of multiple functions into a single device, reducing overall system component count.
  • Substantial I/O capability: 384 I/O pins support designs that require broad external connectivity without external I/O expanders.
  • On-chip memory for local storage: Approximately 73,728 bits of embedded RAM allow for efficient buffering and state retention close to the logic fabric.
  • Compact, manufacturable package: 560-LBGA exposed pad package offers a high pin count in a compact footprint suitable for surface-mount assembly.
  • Straightforward power requirements: 3 V to 3.6 V supply range eases integration into standard 3.3 V system rails.
  • RoHS compliant: Conforms to environmental lead-free requirements for modern electronics production.

Why Choose XC4062XL-1BG560C?

The XC4062XL-1BG560C combines a solid logic element count, generous on-chip RAM, and a high I/O count in a single 560-LBGA package, delivering a balanced mix of integration and board-level density. Its 3 V–3.6 V supply range and commercial temperature rating make it suitable for mainstream embedded and digital designs that require programmable logic and significant I/O capability.

For engineering teams and procurement looking to reduce BOM complexity while retaining flexibility, this FPGA offers a clear, verifiable spec set that supports scalable, long-lived designs with RoHS compliance for modern manufacturing.

If you would like pricing, availability, or to request a quote for the XC4062XL-1BG560C, please submit a request or contact sales to obtain a formal quote and lead-time information.

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