XC4052XLA-08BG432C

The XC4052XLA-08BG432C is a commercial-grade Field Programmable Gate Array (FPGA) IC from AMD’s XC4000XLA family. It provides a balanced combination of programmable logic capacity, embedded RAM, and a high pin-count I/O interface in a compact 432-LBGA exposed-pad package.

Designed for commercial embedded applications, this device supports moderate logic density and on-chip memory while operating from a 3 V to 3.6 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Programmable Logic Capacity 4,598 logic elements and approximately 52,000 gates organized for flexible digital design implementation.
• Configurable Logic Blocks 1,936 LABs/CLBs provide the structural blocks for implementing custom logic functions.
• Embedded Memory Approximately 61,952 bits of on-chip RAM to support buffering, state storage, and small data tables.
• I/O Density 352 user I/O pins accommodate wide bus interfaces and multiple peripheral connections.
• Package & Mounting 432-LBGA exposed pad package (supplier package: 432-MBGA, 40 × 40) with surface-mount mounting for compact board-level integration.
• Power & Temperature Operates from 3 V to 3.6 V and rated for commercial temperature operation from 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction suitable for standard commercial production environments.

Typical Applications

• Commercial Embedded Systems Use the FPGA’s logic resources and on-chip RAM to implement custom control, protocol bridging, and interface logic in compact systems.
• I/O-Intensive Designs The 352 I/O pins support multi-channel data acquisition, parallel sensor interfaces, and wide bus connectivity.
• Prototype and Custom Logic Developers can leverage the device’s configurable logic elements and LABs/CLBs for proof-of-concept and low-to-moderate complexity digital designs.

Unique Advantages

• Balanced Logic Density: 4,598 logic elements and 1,936 LABs/CLBs provide sufficient resources for moderate-complexity designs without excessive board space.
• Substantial On-Chip RAM: Approximately 61,952 bits of embedded memory enable local buffering and state storage, reducing external memory dependence.
• High I/O Count: 352 I/O pins support diverse peripheral connections and parallel interfaces, simplifying system integration.
• Compact BGA Package: The 432-LBGA exposed-pad package with surface-mount mounting enables dense PCB layouts and reliable thermal contact.
• Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match standard commercial product requirements.
• RoHS Compliant: Environmentally compliant construction supports regulatory requirements for commercial electronics.

Why Choose XC4052XLA-08BG432C?

The XC4052XLA-08BG432C positions itself as a practical choice for commercial embedded designs that require moderate programmable logic capacity, on-chip RAM, and a high number of I/O signals in a compact surface-mount BGA footprint. Its 3 V–3.6 V supply range and commercial temperature rating make it suitable for a wide range of standard electronic products.

With RoHS compliance and a 432-LBGA exposed-pad package, this FPGA is aimed at designers seeking a balance of integration, I/O flexibility, and board-level density for prototypes and production systems supported by AMD manufacturing.

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