XC4052XL-3HQ240I

The XC4052XL-3HQ240I is a Field Programmable Gate Array (FPGA) device from the XC4000E/X family in a 240‑BFQFP exposed pad package. It provides a mid‑density programmable logic resource set suitable for industrial applications requiring configurable digital logic, I/O expansion, and embedded memory.

Key architectural points include 4,598 logic elements, approximately 0.062 Mbits of on‑chip RAM, and 193 user I/O pins. The device is designed for surface‑mount assembly and operates across a wide industrial temperature range.

Key Features

• Logic Capacity  4,598 logic elements enabling a substantial amount of user‑defined combinational and sequential logic.
• Embedded Memory  Approximately 0.062 Mbits (61,952 bits) of on‑chip RAM for data buffering, small lookup tables, and state storage.
• I/O Resources  193 user I/O pins to support parallel interfacing, bus connections, and general-purpose signal routing.
• Gate Count  Approximately 52,000 gates for mapping logic and glue functions within system designs.
• Power  3 V to 3.6 V nominal supply range suitable for common 3.3 V systems.
• Package  240‑BFQFP exposed pad (supplier device package: 240‑PQFP, 32×32) optimized for surface‑mount PCB assembly and thermal dissipation via the exposed pad.
• Temperature Range & Grade  Industrial grade operation from −40 °C to 100 °C for use in demanding ambient conditions.
• Mounting & Compliance  Surface‑mount device; RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Control  Programmable logic for control sequencing, signal conditioning, and interface bridging in industrial systems.
• Prototyping and Custom Logic  Hardware prototypes and bespoke digital functions where reprogrammability and moderate logic density are required.
• I/O Expansion  Implement custom I/O handling and parallel bus interfaces using the device’s 193 I/O pins and embedded memory.

Unique Advantages

• Substantial Logic in a Compact Package: 4,598 logic elements and ~52,000 gates provide significant programmable capability while maintaining a 240‑pin footprint.
• Generous I/O Count: 193 user I/O pins enable flexible interfacing to sensors, peripherals, and system buses without external multiplexing.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to meet temperature demands of industrial deployments.
• Surface‑Mount, Exposed‑Pad Package: 240‑BFQFP with exposed pad aids PCB thermal management and streamlines surface‑mount assembly.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious design and manufacture.
• Standard 3.3 V Supply Range: Operation from 3 V to 3.6 V aligns with common 3.3 V system power rails.

Why Choose XC4052XL-3HQ240I?

The XC4052XL-3HQ240I balances programmable logic density, embedded memory, and a high I/O count in a surface‑mount exposed‑pad package tailored for industrial applications. Its specified operating range, RoHS compliance, and standard supply voltage make it a practical choice for designs that require reconfigurable logic, robust interfacing, and predictable thermal handling on PCB assemblies.

This device is suited to engineers and procurement teams building medium‑complexity digital systems, control logic modules, and I/O‑heavy subsystems where a field‑programmable solution reduces board count and accelerates development cycles.

Request a quote or submit a pricing inquiry today to evaluate the XC4052XL-3HQ240I for your next programmable logic design.