XC4052XL-3BG560I

The XC4052XL-3BG560I is an AMD XC4000E/X series Field Programmable Gate Array (FPGA) in a 560-LBGA exposed pad metal package. It provides 4,598 logic elements, approximately 0.062 Mbits of embedded RAM (61,952 bits), 352 user I/Os and 52,000 logic gates for custom digital implementations.

Built to industrial-grade specifications, this surface-mount device supports a 3 V to 3.6 V supply and an operating temperature range of -40°C to 100°C. The supplier device package is a 560-MBGA (42.5×42.5), offering a high pin count in a compact footprint with an exposed pad.

Key Features

• Core Logic  4,598 logic elements and 52,000 gates provide the programmable fabric for custom digital functions and control logic.
• On-chip Memory  Approximately 0.062 Mbits (61,952 bits) of embedded RAM for small buffers, state storage and local data handling.
• I/O Capacity  352 user I/Os enable broad external interfacing and parallel connectivity for complex board-level designs.
• Package and Mounting  560-LBGA exposed pad, metal package (supplier device package: 560-MBGA 42.5×42.5) in a surface-mount form factor for high pin-count, compact layouts.
• Power  Operates from a 3 V to 3.6 V supply range to match common system rails.
• Operating Range and Grade  Industrial-grade device specified for operation from -40°C to 100°C.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Leverage 4,598 logic elements and 352 I/Os to implement custom control logic, I/O aggregation and interface bridging in industrial systems operating across -40°C to 100°C.
• I/O-Intensive Interface Bridging  High I/O count supports parallel bus adaptation and protocol conversion on compact PCBs.
• Embedded State Machines and Data Paths  On-chip RAM and programmable logic enable state-machine implementation, small FIFOs and local buffering for deterministic control tasks.
• Compact Board-Level Integration  560-LBGA package and surface-mount mounting suit dense, space-constrained designs requiring a high pin count.

Unique Advantages

• Dense logic and I/O in one device: 4,598 logic elements paired with 352 I/Os reduce the need for external glue logic and simplify board-level designs.
• Industrial temperature tolerance: Specified for -40°C to 100°C operation, supporting deployment in demanding environments.
• Standard supply range: 3 V to 3.6 V operation aligns with common system power rails for straightforward integration.
• High pin-count, compact package: 560-MBGA (42.5×42.5) with exposed pad delivers a high-density footprint suitable for complex routing and board stacking.
• Materials compliance: RoHS compliance simplifies material selection and regulatory considerations.

Why Choose XC4052XL-3BG560I?

The XC4052XL-3BG560I balances mid-range programmable logic resources with a high I/O count and industrial operating range, making it well suited for engineers designing control, interfacing and compact board-level systems. Its combination of 4,598 logic elements, approximately 0.062 Mbits of embedded RAM and a 560-LBGA exposed pad package provides a practical platform for implementing custom digital functions while meeting industrial temperature and mounting requirements.

This part is appropriate for projects that require a compact, surface-mount FPGA solution with significant I/O capacity and industrial-grade operating limits, offering a clear integration path for systems that must operate across a wide temperature range and standard supply voltages.

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