XC4052XL-1BG432I
| Part Description |
XC4000E/X Field Programmable Gate Array (FPGA) IC 352 61952 4598 432-LBGA Exposed Pad, Metal |
|---|---|
| Quantity | 655 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 432-MBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 432-LBGA Exposed Pad, Metal | Number of I/O | 352 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1936 | Number of Logic Elements/Cells | 4598 | ||
| Number of Gates | 52000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 61952 |
Overview of XC4052XL-1BG432I – XC4000E/X Field Programmable Gate Array (FPGA), 432-LBGA Exposed Pad
The XC4052XL-1BG432I is a field programmable gate array (FPGA) in the XC4000E/X family, presented in a 432-LBGA exposed-pad metal package. It offers a balance of logic capacity, on-chip RAM and a large I/O count aimed at embedded and industrial applications.
With 4,598 logic elements, approximately 61,952 bits of embedded memory, and 352 user I/O, this device targets designs that require moderate logic density, significant I/O connectivity and operation across a wide industrial temperature range.
Key Features
- Core Logic Approximately 4,598 logic elements and 52,000 gates provide programmable logic capacity for custom digital functions.
- Embedded Memory Approximately 61,952 bits of on-chip RAM to support buffering, small lookup tables, and control-state storage.
- I/O Density 352 user I/O pins enable high connector or peripheral counts for interface-heavy designs.
- Power Single-supply operation from 3 V to 3.6 V simplifies power rail planning in systems using 3.3 V logic domains.
- Package & Mounting 432-LBGA exposed pad, metal package (supplier device package: 432-MBGA 40×40) in a surface-mount configuration for compact board layouts and thermal conduction.
- Operating Range Industrial temperature grade with an operating temperature from −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant material and manufacturing status.
Typical Applications
- Industrial Control Logic and I/O density make the device suitable for discrete control, custom state machines and interfacing multiple sensors or actuators within industrial equipment.
- Communications & Networking High I/O count supports protocol bridging, parallel interfacing and custom packet processing in communication modules.
- Embedded Prototyping Programmable logic and on-chip RAM enable rapid development and validation of custom digital blocks and system prototypes.
- High-density I/O Systems Large number of user I/Os is useful for designs requiring many parallel connections, custom front-end interfaces or board-level aggregation.
Unique Advantages
- Balanced Logic and Memory: 4,598 logic elements paired with approximately 61,952 bits of on-chip RAM provides a practical mix for control logic, data buffering and small state machines.
- Extensive I/O Availability: 352 I/O pins reduce the need for external I/O expanders and simplify board-level connectivity.
- Industrial-temperature Operation: Rated for −40 °C to 100 °C operation, enabling use in temperature-challenging environments.
- Compact, Thermally-Conscious Package: 432-LBGA exposed-pad metal package supports surface-mount assembly and aids thermal conduction for sustained operation.
- Standard 3.3 V Domain: 3 V to 3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
- RoHS Compliant: Manufactured to RoHS-compliant standards for environmental and regulatory considerations.
Why Choose XC4052XL-1BG432I?
The XC4052XL-1BG432I positions itself as a practical FPGA choice where a mid-level logic resource, substantial I/O capacity and industrial temperature tolerance are required. Its combination of approximately 4,598 logic elements, around 61,952 bits of embedded memory and 352 I/Os supports a wide range of embedded designs that need on-device programmability without excessive board-level complexity.
This device is well suited to engineers and teams developing industrial controls, communication interfaces, or embedded prototypes who need a compact, surface-mount FPGA with clear electrical and thermal characteristics. Its industrial grade temperature range and RoHS compliance add to long-term deployment options and regulatory alignment.
Request a quote or submit an inquiry for the XC4052XL-1BG432I today to discuss pricing, availability and how it can fit into your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








