XC4052XL-1BG432C

The XC4052XL-1BG432C is a field programmable gate array (FPGA) in the XC4000E/X family designed for commercial embedded logic applications. It combines moderate logic density with a high I/O count and on-chip RAM to address designs that require flexible glue logic, parallel interfaces, and custom peripheral control.

Packaged in a 432-pin LBGA with an exposed pad and specified for 3.0 V to 3.6 V supply operation at 0 °C to 85 °C, this device is suited for commercial systems where board-level integration and a compact package are important.

Key Features

• Logic Capacity  Approximately 4,598 logic elements (LEs) supporting up to 52,000 equivalent gates for medium-complexity logic implementation.
• On-Chip Memory  Approximately 61,952 bits (≈0.062 Mbits) of embedded RAM for small buffers, FIFOs, and state storage.
• High I/O Count  352 I/O pins to support multiple parallel interfaces, external peripherals, and board-level interconnects.
• Packaging  432-LBGA exposed pad, metal package (supplier package: 432-MBGA, 40×40) for compact PCB footprint and thermal conduction to the board.
• Power  Single-supply operation from 3.0 V to 3.6 V for compatibility with common commercial logic domains.
• Mounting & Grade  Surface-mount device with commercial grade qualification and RoHS compliance.
• Operating Range  Rated for operation from 0 °C to 85 °C for standard commercial environmental conditions.

Typical Applications

• Consumer Electronics  Custom interface logic, peripheral bridging, and protocol adaptation where moderate logic and high I/O are required.
• Communications Equipment  Parallel and serial interface handling, control logic, and timing functions that benefit from numerous I/Os and on-chip RAM.
• Embedded Systems  Glue logic, peripheral control, and custom state machines in compact, board-mounted designs.
• Prototyping and Development  FPGA-based proof-of-concept and hardware validation for designs targeting this logic density and I/O scale.

Unique Advantages

• High I/O Density: 352 I/O pins provide extensive external connectivity to minimize the need for additional interface components.
• Moderate Logic Integration: Approximately 4,598 logic elements and 52,000 gates enable implementation of multi-function control and interface blocks in a single device.
• On-Chip RAM: Nearly 62kbits of embedded RAM allows localized buffering and small FIFO implementations without external memory.
• Compact LBGA Package: 432-LBGA with exposed pad and 40×40 supplier package supports dense PCB layouts and board-level thermal paths.
• Commercial Power and Temperature Range: 3.0–3.6 V operation and 0 °C–85 °C rating align with typical commercial system requirements.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally conscious production.

Why Choose XC4052XL-1BG432C?

The XC4052XL-1BG432C offers a balanced combination of logic capacity, substantial I/O, and on-chip RAM in a compact 432-LBGA package for commercial embedded designs. Its electrical and thermal package characteristics support integration into space-constrained PCBs while providing the flexibility of an FPGA for customization and iteration.

This device is well suited to engineers and purchasing teams developing consumer, communications, or embedded applications that require moderate logic density, extensive external connectivity, and RoHS-compliant commercial components. It delivers a pragmatic option for designs that need reprogrammable logic close to peripherals and interfaces.

Request a quote or submit an inquiry to check availability and pricing for the XC4052XL-1BG432C and to discuss how it fits your next design.