XC4044XLA-09HQ208C
| Part Description |
XC4000XLA/XV Field Programmable Gate Array (FPGA) IC 208-BFQFP Exposed Pad |
|---|---|
| Quantity | 1,279 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP Exposed Pad | Number of I/O | 168 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1600 | Number of Logic Elements/Cells | 3800 | ||
| Number of Gates | 27000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200 |
Overview of XC4044XLA-09HQ208C – XC4000XLA/XV Field Programmable Gate Array (FPGA) IC 208-BFQFP Exposed Pad
The XC4044XLA-09HQ208C is a field programmable gate array (FPGA) in the XC4000XLA/XV family packaged in a 208‑lead BFQFP with exposed pad. It provides a compact, surface-mount programmable logic solution with a nominal supply range of 3.0–3.6 V and a commercial operating temperature range of 0 °C to 85 °C.
With thousands of logic elements, embedded RAM and ample I/O, this FPGA targets applications that require user-defined digital logic and moderate on-chip memory within a small-footprint QFP package.
Key Features
- Logic Capacity Approximately 3,800 logic elements enabling customizable digital logic implementations and moderate integration of combinational and sequential functions.
- Logic Blocks 1,600 logic blocks (as specified) to structure user logic and design partitioning.
- Embedded Memory Approximately 51,200 bits of on-chip RAM for small data buffers, FIFOs or state storage within the FPGA fabric.
- I/O Density 168 user I/O pins to support multiple parallel interfaces, control signals or I/O expansion in system designs.
- Gate Equivalent Approximately 27,000 gates for rough sizing and system-level resource planning.
- Power Operates from a 3.0 V to 3.6 V supply, suitable for standard 3.3 V logic systems.
- Package & Mounting 208‑lead BFQFP with exposed pad (supplier package 208‑PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
Typical Applications
- Custom Digital Control Implement glue logic, protocol adapters or moderate-complexity state machines using the device's logic elements and I/O resources.
- Interface and I/O Expansion Use the 168 I/O pins to add parallel interfaces, bus bridging or custom signal conditioning in compact systems.
- Embedded Memory Functions Leverage the on-chip RAM for small buffers, FIFOs or lookup tables in data-path and control applications.
Unique Advantages
- Balanced on-chip resources: A mix of roughly 3,800 logic elements and ~51.2 kbits of RAM supports a wide range of small-to-moderate logic designs without external memory.
- High I/O count in a compact package: 168 I/O pins in a 208‑lead BFQFP enable dense external connectivity while maintaining a small PCB footprint.
- Standard 3.3 V compatibility: 3.0–3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
- Surface-mount assembly friendly: 208‑lead BFQFP with exposed pad supports reliable thermal and mechanical mounting for automated PCB assembly processes.
- Commercial grade and RoHS compliant: Designed for commercial temperature ranges and environmental compliance in consumer and industrial applications operating within 0 °C to 85 °C.
Why Choose XC4044XLA-09HQ208C?
The XC4044XLA-09HQ208C offers a practical balance of programmable logic, embedded RAM and I/O density in a compact 208‑lead BFQFP package. It is suited to designers who need a configurable digital device for control, interfacing and mid-complexity logic integration while adhering to 3.3 V system standards and commercial temperature requirements.
This FPGA provides a predictable set of on-chip resources and packaging that simplify board-level integration and BOM planning, making it a solid choice for development, prototyping and volume designs that fit within its specified electrical and thermal envelope.
Request a quote or submit a purchase inquiry to get pricing and availability for the XC4044XLA-09HQ208C.

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