XC4044XLA-09HQ208C

FPGA, 1600 CLBS, 27000 GATES
Part Description

XC4000XLA/XV Field Programmable Gate Array (FPGA) IC 208-BFQFP Exposed Pad

Quantity 1,279 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFP Exposed PadNumber of I/O168Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH not applicable
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1600Number of Logic Elements/Cells3800
Number of Gates27000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200

Overview of XC4044XLA-09HQ208C – XC4000XLA/XV Field Programmable Gate Array (FPGA) IC 208-BFQFP Exposed Pad

The XC4044XLA-09HQ208C is a field programmable gate array (FPGA) in the XC4000XLA/XV family packaged in a 208‑lead BFQFP with exposed pad. It provides a compact, surface-mount programmable logic solution with a nominal supply range of 3.0–3.6 V and a commercial operating temperature range of 0 °C to 85 °C.

With thousands of logic elements, embedded RAM and ample I/O, this FPGA targets applications that require user-defined digital logic and moderate on-chip memory within a small-footprint QFP package.

Key Features

  • Logic Capacity  Approximately 3,800 logic elements enabling customizable digital logic implementations and moderate integration of combinational and sequential functions.
  • Logic Blocks  1,600 logic blocks (as specified) to structure user logic and design partitioning.
  • Embedded Memory  Approximately 51,200 bits of on-chip RAM for small data buffers, FIFOs or state storage within the FPGA fabric.
  • I/O Density  168 user I/O pins to support multiple parallel interfaces, control signals or I/O expansion in system designs.
  • Gate Equivalent  Approximately 27,000 gates for rough sizing and system-level resource planning.
  • Power  Operates from a 3.0 V to 3.6 V supply, suitable for standard 3.3 V logic systems.
  • Package & Mounting  208‑lead BFQFP with exposed pad (supplier package 208‑PQFP, 28 × 28 mm) in a surface-mount form factor for PCB assembly.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Custom Digital Control  Implement glue logic, protocol adapters or moderate-complexity state machines using the device's logic elements and I/O resources.
  • Interface and I/O Expansion  Use the 168 I/O pins to add parallel interfaces, bus bridging or custom signal conditioning in compact systems.
  • Embedded Memory Functions  Leverage the on-chip RAM for small buffers, FIFOs or lookup tables in data-path and control applications.

Unique Advantages

  • Balanced on-chip resources:  A mix of roughly 3,800 logic elements and ~51.2 kbits of RAM supports a wide range of small-to-moderate logic designs without external memory.
  • High I/O count in a compact package:  168 I/O pins in a 208‑lead BFQFP enable dense external connectivity while maintaining a small PCB footprint.
  • Standard 3.3 V compatibility:  3.0–3.6 V supply range aligns with common 3.3 V system rails for straightforward power integration.
  • Surface-mount assembly friendly:  208‑lead BFQFP with exposed pad supports reliable thermal and mechanical mounting for automated PCB assembly processes.
  • Commercial grade and RoHS compliant:  Designed for commercial temperature ranges and environmental compliance in consumer and industrial applications operating within 0 °C to 85 °C.

Why Choose XC4044XLA-09HQ208C?

The XC4044XLA-09HQ208C offers a practical balance of programmable logic, embedded RAM and I/O density in a compact 208‑lead BFQFP package. It is suited to designers who need a configurable digital device for control, interfacing and mid-complexity logic integration while adhering to 3.3 V system standards and commercial temperature requirements.

This FPGA provides a predictable set of on-chip resources and packaging that simplify board-level integration and BOM planning, making it a solid choice for development, prototyping and volume designs that fit within its specified electrical and thermal envelope.

Request a quote or submit a purchase inquiry to get pricing and availability for the XC4044XLA-09HQ208C.

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