XC4VLX60-10FF668I

The XC4VLX60-10FF668I is a Virtex-4 LX field programmable gate array (FPGA) supplied in a 668-ball FCBGA package. It delivers a high logic element count and substantial on-chip memory in a surface-mount package targeted at industrial-temperature designs. Key value factors include a large I/O count, a wide operating temperature range, and a defined low-voltage core supply.

Key Features

• Core Capacity — 59,904 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 2.95 Mbits of on-chip RAM for buffering, state storage, and implementation of memory-intensive functions.
• I/O Resources — 448 user I/O pins to support wide external interfacing and parallel connectivity.
• Package — 668-ball FCBGA (668-BBGA), supplier device package 668-FCBGA (27×27), designed for surface-mount assembly.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match system power rails and enable predictable power planning.
• Temperature and Grade — Industrial-grade device specified for an operating temperature range of −40 °C to 100 °C.
• Regulatory Compliance — RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• High-density logic implementations — Use where large numbers of logic elements are required to implement complex state machines, protocol stacks, or custom processing pipelines.
• Memory-intensive designs — Suitable for designs that need several megabits of embedded RAM for buffering, FIFOs, or on-chip data storage.
• High-pin-count interfacing — Ideal for systems that require up to 448 I/O signals for parallel buses, multi-channel I/O, or mixed-signal interfacing.
• Industrial temperature systems — Targeted for applications that operate across −40 °C to 100 °C and require industrial-grade components.

Unique Advantages

• Large programmable resource pool: 59,904 logic elements enable integration of multiple functions on a single device, reducing board-level component count.
• On-chip memory capacity: Approximately 2.95 Mbits of embedded RAM minimizes external memory dependencies for many designs.
• Extensive I/O availability: 448 I/Os provide flexibility for complex connectivity and broad peripheral support without multiplexing compromise.
• Industrial-grade operation: Specified for −40 °C to 100 °C operation to support deployments in demanding environmental conditions.
• Compact FCBGA package: 668-FCBGA (27×27) delivers a high pin count in a space-conscious, surface-mount form factor for dense board designs.
• RoHS compliant: Conforms to lead-free manufacturing requirements for regulated assembly processes.

Why Choose XC4VLX60-10FF668I?

The XC4VLX60-10FF668I positions itself as a high-capacity Virtex-4 LX FPGA option for industrial-temperature systems that require a combination of abundant logic resources, multi-megabit on-chip memory, and large I/O capability. Its defined core voltage range and standardized 668-ball FCBGA package support predictable integration into power and mechanical designs.

This device is suitable for engineering teams seeking to consolidate multiple functions into a single programmable device, reduce board-level component count, and maintain operation across a wide temperature range. Its RoHS compliance and surface-mount form factor aid modern manufacturing and assembly flows.

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