XC4VLX60-10FFG668I

The XC4VLX60-10FFG668I is a Virtex-4 LX family field-programmable gate array (FPGA) from AMD designed for high-density programmable logic implementations. It combines a large logic fabric with embedded RAM and a high I/O count to address demanding digital designs.

With 59,904 logic elements and approximately 2.95 Mbits of on-chip RAM, this industrial-grade, surface-mount FCBGA device is targeted at applications that require substantial logic capacity, extensive interfacing, and operation across an industrial temperature range.

Key Features

• Logic Capacity — 59,904 logic elements to implement complex digital designs and custom logic functions.
• Embedded Memory — Approximately 2.95 Mbits of on-chip RAM for buffering, state storage, and data manipulation without external memory.
• I/O Density — 448 user I/O pins to support wide parallel interfaces, multiple protocol endpoints, and dense connector requirements.
• Supply Voltage — Core voltage range of 1.14 V to 1.26 V to match system power-delivery specifications.
• Industrial Temperature Rating — Qualified for operation from -40 °C to 100 °C for deployment in industrial environments.
• Package & Mounting — 668-ball FCBGA package (668-FCBGA, 27 × 27) in a surface-mount form factor for compact board integration.

Typical Applications

• High-density digital processing — Implements large-scale custom logic and data-paths requiring tens of thousands of logic elements.
• Interface aggregation — Supports systems that require many parallel or serialized I/O connections thanks to its 448 user I/O pins.
• Embedded buffering and state machines — Uses onboard RAM for data buffering, packet handling, and control-state storage without immediate external memory.

Unique Advantages

• High logic integration: 59,904 logic elements reduce the need for multiple discrete FPGAs or external glue logic.
• Substantial on-chip memory: Approximately 2.95 Mbits of embedded RAM supports local buffering and reduces external memory bandwidth requirements.
• Extensive I/O options: 448 I/O pins enable broad connectivity for multi-channel and multi-protocol designs.
• Industrial temperature support: Rated from -40 °C to 100 °C for reliable operation in industrial settings.
• Compact FCBGA packaging: 668-FCBGA (27 × 27) surface-mount package offers a balance of pin density and board-level integration.
• Controlled core voltage range: 1.14 V to 1.26 V supply requirement aligns with precise power-delivery designs.

Why Choose XC4VLX60-10FFG668I?

The XC4VLX60-10FFG668I positions itself as a high-capacity, industrial-grade FPGA solution for designers who need large programmable logic resources, meaningful on-chip RAM, and a high number of I/O pins in a single device. Its surface-mount 668-FCBGA package and defined supply/temperature ranges make it suitable for compact, robust system designs.

This device is well suited for engineers and procurement teams developing complex digital systems that require a combination of logic density, embedded memory, and broad interfacing while meeting industrial environmental requirements.

Request a quote or submit a procurement inquiry to learn about availability and lead times for the XC4VLX60-10FFG668I.