XC4VLX60-11FFG1148C

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 640 2949120 59904 1148-BBGA, FCBGA

Quantity 1,472 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6656Number of Logic Elements/Cells59904
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2949120

Overview of XC4VLX60-11FFG1148C – Virtex®-4 LX FPGA, 59,904 Logic Elements, 640 I/O

The XC4VLX60-11FFG1148C is a Virtex®-4 LX field programmable gate array (FPGA) from AMD supplied in a 1148-BBGA FCBGA surface-mount package. It delivers a high logic capacity and dense I/O in a compact package, with on-chip embedded memory to support complex digital designs in commercial applications.

Key on-board resources include 59,904 logic elements, approximately 2.95 Mbits of embedded RAM, and 640 general-purpose I/O pins. The device operates from a 1.14 V to 1.26 V supply and is specified for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

  • Core Logic  59,904 logic elements to implement complex state machines, datapaths, and custom hardware accelerators.
  • Embedded Memory  Approximately 2.95 Mbits of on-chip RAM for buffering, FIFOs, and lookup tables to support data-intensive designs.
  • I/O Density  640 user I/O pins enable wide parallel interfaces, multi-channel connectivity, and high pin-count designs.
  • Package & Mounting  1148‑BBGA (FCBGA) package in a surface-mount format with a 35 × 35 mm footprint for board-level density.
  • Power  Core supply range from 1.14 V to 1.26 V to match system power rails and design constraints.
  • Temperature Rating  Commercial operating range 0 °C to 85 °C for typical commercial environment deployments.
  • Regulatory  RoHS compliant to meet environmental and materials requirements.

Typical Applications

  • Embedded Systems & Prototyping  Implement complex control logic, custom peripherals, and prototype ASIC functions using the device’s high logic element count and embedded RAM.
  • Signal Processing & DSP  Leverage abundant logic and on-chip memory to build streaming datapaths, filtering, and hardware accelerators for real-time processing tasks.
  • Communications & Networking  Aggregate multiple interfaces and implement protocol logic with the 640 I/O pins for custom PHY, bridging, and packet processing functions.
  • High-Density Interface Control  Use the combination of dense I/O and logic to manage large sensor arrays, multi-channel data converters, or parallel peripherals.

Unique Advantages

  • Highly Integrated Logic Resource:  59,904 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Substantial On-Chip Memory:  Approximately 2.95 Mbits of embedded RAM supports buffering and local data storage without external memory.
  • Extensive I/O Capacity:  640 I/O pins provide flexibility for wide parallel buses, multi-lane interfaces, and dense connectivity requirements.
  • Compact Surface-Mount Package:  The 1148-BBGA FCBGA (35 × 35) package enables high integration on space-constrained PCBs.
  • Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose XC4VLX60-11FFG1148C?

The XC4VLX60-11FFG1148C provides a balance of high logic capacity, embedded memory, and extensive I/O in a compact FCBGA package from AMD. It is suited to commercial designs that require significant programmable logic and on-chip resources to implement custom hardware functions, protocol logic, or data processing pipelines.

For teams prioritizing integration and board-level density, this Virtex®-4 LX device offers a scalable platform to consolidate functions and reduce component count while meeting standard commercial temperature and environmental requirements.

Request a quote or submit an inquiry to check availability, obtain pricing, and discuss how the XC4VLX60-11FFG1148C can fit your design requirements.

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