XC4VLX60-11FFG668C

The XC4VLX60-11FFG668C is a Virtex®-4 LX family FPGA from AMD, offered as a 668-ball FCBGA surface-mount device. It provides a high logic capacity and on-chip memory in a compact 27 × 27 mm package suited for commercial electronic designs.

With 59,904 logic elements and approximately 2.95 Mbits of embedded memory, this device addresses designs requiring substantial programmable logic, large I/O counts, and controlled supply and thermal operating ranges.

Key Features

• Core Architecture Virtex-4 LX FPGA architecture in the XC4VLX60-11FFG668C offering 59,904 logic elements for complex logic implementation.
• Configurable Logic Blocks 6,656 CLBs (configurable logic blocks) for flexible logic partitioning and design scaling.
• On-Chip Memory Approximately 2.95 Mbits of embedded RAM (2,949,120 bits) to support buffering, state storage, and data-path acceleration.
• I/O Density 448 user I/O pins to support wide bus interfaces, parallel peripherals, and high-pin-count connectivity.
• Package and Mounting 668-BBGA FCBGA package (668-FCBGA, 27 × 27 mm) designed for surface-mount assembly in compact layouts.
• Power Supply Core supply operation from 1.14 V to 1.26 V to match specified system power rails.
• Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operating temperature range.
• Compliance RoHS-compliant construction for regulatory alignment in standard commercial products.

Typical Applications

• Custom Logic Implementation Programmable logic for implementing application-specific digital functions and glue logic where high logic capacity is needed.
• Prototyping and Development Platform for hardware prototyping and proof-of-concept designs that require significant on-chip resources and reprogrammability.
• High-Density I/O Control Managing wide parallel interfaces or multiple peripheral connections using the device’s 448 I/O pins.
• Embedded Memory-Dependent Designs Designs that leverage approximately 2.95 Mbits of embedded RAM for buffering, lookup tables, or state machines.

Unique Advantages

• High Logic Capacity: 59,904 logic elements enable complex designs and feature-rich implementations without external logic.
• Significant On-Chip Memory: Approximately 2.95 Mbits of embedded RAM reduce dependence on external memory for many data-path tasks.
• Large I/O Count: 448 I/O pins provide flexibility for broad interfacing needs, simplifying system partitioning and board routing.
• Compact BGA Package: 668-ball FCBGA (27 × 27 mm) balances board-space efficiency with high-pin connectivity for compact assemblies.
• Defined Power Envelope: Core supply range of 1.14 V to 1.26 V supports stable integration with compatible power systems.
• Commercial Readiness: Commercial-grade rating and RoHS compliance make the device suitable for standard commercial product lifecycles.

Why Choose XC4VLX60-11FFG668C?

The XC4VLX60-11FFG668C offers a combination of large programmable logic capacity, substantial embedded memory, and high I/O density in a compact FCBGA package. It is positioned for designers who need programmable, scalable logic resources within the constraints of commercial temperature and power requirements.

Manufactured by AMD and supplied in a surface-mount 668-BBGA package, this FPGA is appropriate for teams focused on feature-rich, reconfigurable digital designs that benefit from on-chip RAM, plentiful I/O, and a clearly defined supply and thermal envelope.

Request a quote or submit an inquiry to begin procurement of the XC4VLX60-11FFG668C for your next design.