XC4VLX60-11FF1148I

IC FPGA 640 I/O 1148FCBGA
Part Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 640 2949120 59904 1148-BBGA, FCBGA

Quantity 259 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1148-FCPBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1148-BBGA, FCBGANumber of I/O640Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs6656Number of Logic Elements/Cells59904
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2949120

Overview of XC4VLX60-11FF1148I – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC, 1148-BBGA

The XC4VLX60-11FF1148I is a Virtex‑4 LX Field Programmable Gate Array (FPGA) offering a high-density programmable logic fabric in a 1148‑ball FCBGA package. It provides a combination of sizable logic resources, on‑chip embedded memory, and a large I/O count suitable for designs that require significant integration within an industrial temperature range.

Key Features

  • Logic Capacity — 6,656 configurable logic blocks (CLBs) with approximately 59,904 logic elements, delivering substantial programmable logic resources for complex designs.
  • Embedded Memory — Approximately 2.95 Mbits of on‑chip RAM, enabling local data buffering and state storage without external memory for many use cases.
  • I/O — 640 I/O pins to support extensive peripheral interfacing and system-level connectivity requirements.
  • Package — 1148‑BBGA FCBGA package (supplier device package: 1148‑FCPBGA, 35×35) in a surface‑mount form factor for board‑level integration.
  • Power — Core voltage supply range of 1.14 V to 1.26 V, enabling predictable power domain planning.
  • Industrial Grade & Temperature Range — Industrial grade device rated for operation from −40 °C to 100 °C, suitable for temperature‑sensitive deployments.
  • RoHS Compliance — Conforms to RoHS requirements for lead‑free assembly and regulatory alignment.

Typical Applications

  • Industrial Control — Use the device for motor control, PLC logic, and factory automation tasks where high I/O counts and industrial temperature operation are required.
  • Data Buffering and Protocol Bridging — The combination of large on‑chip RAM and extensive logic resources suits packet buffering, protocol conversion, and glue logic between subsystems.
  • High‑Density I/O Systems — Ideal for designs requiring many simultaneous I/O connections, such as multi‑channel data acquisition, sensor interfaces, and complex peripheral aggregation.

Unique Advantages

  • High Logic Density: Approximately 59,904 logic elements let you implement complex functions and state machines within a single device, reducing board-level component count.
  • Significant On‑Chip Memory: Nearly 2.95 Mbits of embedded RAM lowers dependence on external memory for many buffering and scratchpad requirements.
  • Extensive I/O Capability: 640 I/O pins support broad sensor, actuator, and peripheral connectivity without additional I/O expanders.
  • Industrial Temperature Rating: Operation from −40 °C to 100 °C enables deployment in harsher ambient conditions common in industrial environments.
  • Compact Surface‑Mount Package: The 1148‑ball FCBGA (35×35) package balances high device density with board‑level integration for space‑constrained designs.
  • Regulatory Compliance: RoHS compliance supports lead‑free assembly and simplifies integration into RoHS‑aligned product lines.

Why Choose XC4VLX60-11FF1148I?

The XC4VLX60-11FF1148I positions itself as a high‑density, industrial‑grade Virtex‑4 LX FPGA that combines substantial logic elements, nearly 3 Mbits of embedded RAM, and a 640‑pin I/O fabric in a 1148‑ball FCBGA surface‑mount package. These characteristics make it well suited to engineering teams designing complex, I/O‑intensive systems that must operate across a wide temperature range.

Choosing this device helps consolidate logic and memory functions into a single programmable component, simplifying board design while maintaining flexibility for iterative development and late-stage function changes. RoHS compliance and a defined core voltage range further support predictable manufacturing and power planning.

Request a quote or submit your procurement inquiry for the XC4VLX60-11FF1148I to evaluate its fit for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up