XC4VLX60-11FF1148I
| Part Description |
Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 640 2949120 59904 1148-BBGA, FCBGA |
|---|---|
| Quantity | 259 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1148-FCPBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1148-BBGA, FCBGA | Number of I/O | 640 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 6656 | Number of Logic Elements/Cells | 59904 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2949120 |
Overview of XC4VLX60-11FF1148I – Virtex®-4 LX Field Programmable Gate Array (FPGA) IC, 1148-BBGA
The XC4VLX60-11FF1148I is a Virtex‑4 LX Field Programmable Gate Array (FPGA) offering a high-density programmable logic fabric in a 1148‑ball FCBGA package. It provides a combination of sizable logic resources, on‑chip embedded memory, and a large I/O count suitable for designs that require significant integration within an industrial temperature range.
Key Features
- Logic Capacity — 6,656 configurable logic blocks (CLBs) with approximately 59,904 logic elements, delivering substantial programmable logic resources for complex designs.
- Embedded Memory — Approximately 2.95 Mbits of on‑chip RAM, enabling local data buffering and state storage without external memory for many use cases.
- I/O — 640 I/O pins to support extensive peripheral interfacing and system-level connectivity requirements.
- Package — 1148‑BBGA FCBGA package (supplier device package: 1148‑FCPBGA, 35×35) in a surface‑mount form factor for board‑level integration.
- Power — Core voltage supply range of 1.14 V to 1.26 V, enabling predictable power domain planning.
- Industrial Grade & Temperature Range — Industrial grade device rated for operation from −40 °C to 100 °C, suitable for temperature‑sensitive deployments.
- RoHS Compliance — Conforms to RoHS requirements for lead‑free assembly and regulatory alignment.
Typical Applications
- Industrial Control — Use the device for motor control, PLC logic, and factory automation tasks where high I/O counts and industrial temperature operation are required.
- Data Buffering and Protocol Bridging — The combination of large on‑chip RAM and extensive logic resources suits packet buffering, protocol conversion, and glue logic between subsystems.
- High‑Density I/O Systems — Ideal for designs requiring many simultaneous I/O connections, such as multi‑channel data acquisition, sensor interfaces, and complex peripheral aggregation.
Unique Advantages
- High Logic Density: Approximately 59,904 logic elements let you implement complex functions and state machines within a single device, reducing board-level component count.
- Significant On‑Chip Memory: Nearly 2.95 Mbits of embedded RAM lowers dependence on external memory for many buffering and scratchpad requirements.
- Extensive I/O Capability: 640 I/O pins support broad sensor, actuator, and peripheral connectivity without additional I/O expanders.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C enables deployment in harsher ambient conditions common in industrial environments.
- Compact Surface‑Mount Package: The 1148‑ball FCBGA (35×35) package balances high device density with board‑level integration for space‑constrained designs.
- Regulatory Compliance: RoHS compliance supports lead‑free assembly and simplifies integration into RoHS‑aligned product lines.
Why Choose XC4VLX60-11FF1148I?
The XC4VLX60-11FF1148I positions itself as a high‑density, industrial‑grade Virtex‑4 LX FPGA that combines substantial logic elements, nearly 3 Mbits of embedded RAM, and a 640‑pin I/O fabric in a 1148‑ball FCBGA surface‑mount package. These characteristics make it well suited to engineering teams designing complex, I/O‑intensive systems that must operate across a wide temperature range.
Choosing this device helps consolidate logic and memory functions into a single programmable component, simplifying board design while maintaining flexibility for iterative development and late-stage function changes. RoHS compliance and a defined core voltage range further support predictable manufacturing and power planning.
Request a quote or submit your procurement inquiry for the XC4VLX60-11FF1148I to evaluate its fit for your next design.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








