XC4VLX60-10FFG668C

The XC4VLX60-10FFG668C is a Virtex®-4 LX Field Programmable Gate Array (FPGA) IC manufactured by AMD. It integrates a high count of programmable logic with substantial on-chip memory and a large I/O complement in a dense ball-grid array package.

Key device indicators include 59,904 logic elements, approximately 2.95 Mbits of embedded RAM, 448 user I/O pins, a 668-FCBGA package (27 × 27 mm), a supply voltage range of 1.14–1.26 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and intended for surface-mount assembly.

Key Features

• Core Logic  Provides 59,904 logic elements for implementing complex digital circuits and programmable functions.
• Embedded Memory  Approximately 2.95 Mbits of on-chip RAM to support data buffering, state storage, and algorithmic working memory.
• High I/O Count  448 user I/O pins enable extensive external interfacing and parallel connectivity to peripherals and subsystems.
• Package & Mounting  Delivered in a 668-FCBGA (27 × 27 mm) package designed for surface-mount assembly, offering high density interconnect.
• Power  Operates from a supply voltage range of 1.14 V to 1.26 V, suitable for the device’s internal core requirements.
• Operating Range  Commercial-grade operating temperature specified from 0 °C to 85 °C.
• Regulatory  RoHS compliant, supporting lead-free assembly processes.

Typical Applications

• Custom digital logic and prototyping  Use the device’s 59,904 logic elements to implement and iterate complex programmable logic designs.
• Memory-intensive processing  On-chip RAM (approximately 2.95 Mbits) supports buffering and intermediate data storage for algorithms and state machines.
• High-density I/O interfacing  With 448 I/Os, integrate multiple external peripherals, sensors, and parallel interfaces directly to the FPGA.

Unique Advantages

• High logic capacity: 59,904 logic elements enable sizable and sophisticated digital implementations without external logic expansion.
• Substantial embedded memory: Approximately 2.95 Mbits of on-chip RAM reduces reliance on external memory for many designs.
• Extensive I/O resources: 448 user I/Os allow broad connectivity options for complex system-level integration.
• Dense, industry-standard package: The 668-FCBGA (27 × 27 mm) package delivers high signal density in a compact surface-mount form factor.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance support mainstream electronic product assemblies.
• Controlled core supply: Narrow supply voltage range (1.14–1.26 V) provides defined power requirements for system power planning.

Why Choose XC4VLX60-10FFG668C?

The XC4VLX60-10FFG668C combines a large programmable logic fabric, meaningful on-chip RAM capacity, and broad I/O resources in a compact 668-FCBGA package. These documented attributes make it suitable for designers who require dense logic integration, embedded memory, and extensive interfacing within a commercial-temperature FPGA platform.

Its RoHS compliance, surface-mount package, and defined electrical and thermal specifications support predictable integration into production-level designs where part selection is based on verifiable device parameters.

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