XC4VLX60-11FF668I

The XC4VLX60-11FF668I is a Virtex®-4 LX field programmable gate array (FPGA) from AMD. It provides a high level of on-chip logic capacity, embedded memory and I/O resources in a 668-ball FCBGA package targeted at industrial applications.

Key device attributes include 59,904 logic elements, approximately 2.95 Mbits of embedded memory, 448 user I/Os, and an industrial operating temperature range, making it suitable for demanding designs that require substantial integration and I/O density.

Key Features

• Logic Capacity — 59,904 logic elements suitable for complex programmable logic implementations.
• Embedded Memory — Approximately 2.95 Mbits of on-chip RAM to support data buffering, FIFOs and local storage.
• I/O Resources — 448 user I/Os to enable wide parallel interfacing and flexible board-level connectivity.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device power domain.
• Package & Mounting — 668-FCBGA (27×27) supplier device package; surface mount mounting type suitable for compact board designs.
• Operating Range — Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature range and extensive I/O count support control systems and factory automation interfaces.
• Communications Infrastructure — Large logic capacity and embedded RAM provide resources for protocol handling, data formatting and buffering tasks.
• High‑I/O Embedded Systems — 448 user I/Os allow for dense parallel connections to sensors, peripherals and custom interfaces.

Unique Advantages

• Substantial Logic Density: 59,904 logic elements enable integration of complex custom logic functions on a single device, reducing board-level component count.
• On‑Chip Memory: Approximately 2.95 Mbits of embedded RAM for local buffering, temporary storage and deterministic data handling without external memory.
• Extensive I/O Complement: 448 user I/Os simplify system-level interfacing and support multiple parallel or mixed-signal connections.
• Industrial Temperature Qualification: Rated for −40 °C to 100 °C operation to meet a wide range of industrial deployment conditions.
• Compact BGA Package: 668-FCBGA (27×27) package provides a high-density footprint for space-constrained PCBs while supporting surface-mount assembly.
• Regulatory Compliance: RoHS compliant to support environmentally conscious product designs.

Why Choose XC4VLX60-11FF668I?

The XC4VLX60-11FF668I combines significant logic capacity, embedded memory and a high I/O count in a single industrial-grade FCBGA package, offering a compact platform for designs that require substantial on-chip resources and robust operating temperature capability. As an AMD Virtex‑4 LX device, it provides a clear specification set for engineers seeking a programmable solution with defined power, thermal and packaging characteristics.

This device is well suited for design teams and procurement professionals targeting industrial and infrastructure projects that need scalable logic, local memory and wide connectivity while maintaining compliance with RoHS requirements.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XC4VLX60-11FF668I.