XC4VLX60-12FF668C

The XC4VLX60-12FF668C is a Virtex-4 LX field programmable gate array (FPGA) IC from AMD supplied in a 668-FCBGA (27×27) package. It provides a high-density logic fabric with significant on-chip memory and a large external I/O count for commercial designs.

Key device attributes include 59,904 logic elements, approximately 2.95 Mbits of embedded memory, 448 I/O pins, a supply operating range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity Contains 59,904 logic elements to implement complex, high-density digital designs.
• Embedded Memory Approximately 2.95 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage.
• I/O Density 448 general-purpose I/O pins for broad interfacing options with external peripherals and systems.
• Package & Mounting Supplied in a 668-FCBGA (27×27) package designed for surface-mount assembly.
• Power Operates from a core supply range of 1.14 V to 1.26 V, enabling consistent power delivery for core logic.
• Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
• Compliance RoHS compliant.

Typical Applications

• Commercial embedded systems — Programmable logic and on-chip memory for control, data processing, and custom interfaces in commercial products.
• High-density I/O applications — Large I/O count supports systems that require extensive external device interfacing or parallel connectivity.
• System integration and prototyping — Dense logic and embedded RAM enable integration of multiple digital functions for evaluation and development platforms.

Unique Advantages

• High logic integration: 59,904 logic elements allow consolidation of multiple functions into a single programmable device, reducing board-level component count.
• Substantial on-chip memory: Approximately 2.95 Mbits of embedded RAM supports buffering and data structures without immediate reliance on external memory.
• Extensive I/O capacity: 448 I/O pins give designers flexibility for interfacing to a wide range of peripherals and parallel buses.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet requirements for commercial-grade deployments.
• Compact surface-mount package: 668-FCBGA (27×27) delivers high pin density in a surface-mount form factor suitable for space-constrained boards.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance.

Why Choose XC4VLX60-12FF668C?

The XC4VLX60-12FF668C positions itself as a high-density, commercially rated FPGA option where significant logic capacity, embedded memory, and extensive I/O are required in a single device. Its 668-FCBGA package and surface-mount mounting support compact board layouts while the specified supply and temperature ranges align with commercial system requirements.

This part is suited to designers and teams looking to consolidate digital functions, implement substantial on-chip buffering, and interface to many external signals without adding discrete logic. Its combination of logic resources, memory, and I/O offers long-term value for scalable commercial designs.

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