XC4VLX60-11FFG668I

The XC4VLX60-11FFG668I is an AMD Virtex®-4 LX Field Programmable Gate Array (FPGA) supplied in a 668-ball FCBGA package. It delivers a high logic capacity and on-chip memory in a surface-mount FCBGA suitable for industrial-temperature environments.

Key silicon characteristics include 59,904 logic elements, approximately 2.95 Mbits of embedded memory, 448 I/O, a supply voltage range of 1.14 V to 1.26 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core / Logic Capacity 59,904 logic elements to implement complex, custom logic and parallel processing functions.
• Embedded Memory Approximately 2.95 Mbits of on-chip RAM for buffering, local storage, and memory-intensive logic tasks.
• I/O 448 general-purpose I/O pins to support high-density interfacing and multi-peripheral connectivity.
• Power Nominal supply operating window from 1.14 V to 1.26 V for core power domains.
• Package and Mounting 668-FCBGA (27×27) / 668-BBGA package in a surface-mount form factor for compact board integration.
• Temperature and Grade Industrial grade device rated for −40 °C to 100 °C operation.
• Environmental Compliance RoHS compliant.

Typical Applications

• System Prototyping and Development — Implement and iterate custom digital logic and system-level prototypes that require substantial logic capacity and embedded memory.
• High-density I/O Processing — Aggregate and route many parallel signals or interfaces using the device's 448 I/O pins.
• Signal and Data Processing — Deploy on-chip RAM and large logic resources for custom signal processing, buffering, and real-time data handling.
• Industrial Control and Automation — Use the industrial temperature rating and robust packaging for control functions in temperature-demanding environments.

Unique Advantages

• High Logic Density: 59,904 logic elements enable implementation of complex logic functions within a single FPGA, reducing board-level component count.
• Substantial On-chip Memory: Approximately 2.95 Mbits of embedded RAM supports local buffering and memory-dependent algorithms without external memory.
• Large I/O Count: 448 I/O pins facilitate direct connectivity to multiple peripherals and interfaces, simplifying system integration.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging industrial applications.
• Compact FCBGA Package: 668-FCBGA (27×27) surface-mount package allows dense PCB layouts while maintaining high pin count.
• RoHS Compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose XC4VLX60-11FFG668I?

The XC4VLX60-11FFG668I positions itself as a high-capacity Virtex®-4 LX FPGA option for designs that require a combination of large logic resources, significant on-chip memory, and a high I/O count in an industrial-temperature package. Its supply voltage range and surface-mount 668-FCBGA footprint support compact, power-conscious board designs.

This AMD-manufactured device is suited to engineers and teams building complex programmable logic systems, high-density I/O interfaces, or memory-dependent processing blocks where on-chip resources and industrial-grade operating range are important considerations.

Request a quote or submit a pricing inquiry for the XC4VLX60-11FFG668I to receive availability and purchasing information tailored to your project needs.