XC5VLX110T-1FF1738C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 5455872 110592 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,281 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 680 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VLX110T-1FF1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC
The XC5VLX110T-1FF1738C is a Virtex®-5 LXT field programmable gate array from AMD delivered in a 1738-ball FCBGA package. It provides a large logic fabric with 110,592 logic elements and approximately 5.46 Mbits of embedded RAM, together with 680 user I/Os, making it suitable for complex digital integration on commercial-temperature designs.
Designed for surface-mount board assembly, the device operates from a core voltage range of 0.95 V to 1.05 V and is specified for an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and supplied in a 1738-FCBGA (42.5×42.5 mm) package.
Key Features
- Logic Capacity 110,592 logic elements provide a large programmable fabric for implementing complex logic, control and data-path functions.
- Embedded Memory Approximately 5.46 Mbits of on-chip RAM supports buffering, FIFOs and on-chip data storage to reduce external memory requirements.
- High I/O Count 680 user I/Os enable broad connectivity for parallel interfaces, high-pin-count peripherals and multi-channel systems.
- Package and Mounting 1738-FCBGA (42.5×42.5 mm) package in a surface-mount ball-grid array form factor for high-density PCB designs.
- Power Supply Core voltage range of 0.95 V to 1.05 V for the device core supply.
- Temperature and Grade Commercial-grade device specified for 0 °C to 85 °C operation.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- Large programmable fabric: 110,592 logic elements enable integration of complex logic and multiple functions on a single device, reducing system part count.
- Substantial on-chip memory: Approximately 5.46 Mbits of embedded RAM helps minimize external memory dependencies and simplifies board-level design.
- Extensive I/O resources: 680 I/Os provide flexibility for interfacing with numerous peripherals, parallel buses and external devices.
- Dense ball-grid package: The 1738-FCBGA (42.5×42.5 mm) package supports high pin count and compact PCB layout for space-constrained systems.
- Commercial temperature rating: Specified 0 °C to 85 °C range aligns with a wide set of commercial electronic applications.
- Manufacturer backing: Provided by AMD, ensuring traceability to a recognized FPGA vendor.
Why Choose XC5VLX110T-1FF1738C?
The XC5VLX110T-1FF1738C delivers a combination of high logic capacity, substantial embedded memory and a large I/O complement in a single commercial-grade FCBGA package. Its specification set makes it well suited for designs that require significant on-chip logic and memory resources while maintaining a compact, surface-mount footprint.
Produced by AMD and offered in a 1738-FCBGA package, this device is appropriate for engineering teams targeting complex digital systems within commercial temperature ranges who need a verified, high-capacity FPGA building block.
Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC5VLX110T-1FF1738C.

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