XC5VLX110T-1FFG1136I

The XC5VLX110T-1FFG1136I is a Virtex-5 LXT field programmable gate array (FPGA) offered in a 1136-FCBGA package. It provides a large pool of programmable logic, embedded memory, and a high I/O count for demanding embedded and industrial designs.

With 110,592 logic elements, approximately 5.46 Mbits of embedded memory, and 640 I/Os, this device targets designs that require high logic density, significant on-chip RAM, and extensive external connectivity while operating across an industrial temperature range.

Key Features

• Core Logic 110,592 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory Approximately 5.46 Mbits of on-chip RAM (5,455,872 total RAM bits) to support data buffering, state storage, and memory-mapped logic.
• I/O Capacity 640 I/Os to support extensive peripheral and board-level interfacing requirements.
• Power Specified core voltage supply range of 0.95 V to 1.05 V to match system power design requirements.
• Package & Mounting 1136-BBGA (1136-FCBGA, 35 × 35 mm) in a surface-mount package for high-density PCB assembly.
• Operating Range & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C suited for temperature-challenging environments.

Typical Applications

• Industrial Automation — Implement complex control logic, protocol bridging, and I/O aggregation for factory and process automation systems.
• Embedded Systems — Provide on-chip memory and programmable logic for custom data processing, state machines, and low-latency control tasks.
• I/O-Intensive Designs — Support systems that require high pin counts and multiple external interfaces, such as test equipment and instrumentation.

Unique Advantages

• High Logic Density: 110,592 logic elements enable large, integrated designs without partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 5.46 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Extensive Connectivity: 640 I/Os provide flexibility for complex board-level integration and multiple peripheral interfaces.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-demanding industrial environments.
• Compact, High-Density Package: 1136-FCBGA (35 × 35 mm) surface-mount package enables dense PCB layouts while accommodating high I/O and logic counts.
• Controlled Core Voltage: Narrow supply window (0.95–1.05 V) gives designers predictable power requirements for system power architecture.

Why Choose XC5VLX110T-1FFG1136I?

The XC5VLX110T-1FFG1136I combines a large logic fabric, significant embedded memory, and a high I/O count in an industrial-temperature rated, surface-mount 1136-FCBGA package. It is positioned for engineers seeking a single-chip solution to implement complex programmable designs with substantial on-chip RAM and extensive external connectivity.

This device suits development teams and system integrators working on industrial embedded systems, I/O-dense platforms, and designs that require reliable operation across a wide temperature range. The combination of logic capacity, memory, and packaging supports scalability and integration while aligning with industrial deployment requirements.

Request a quote or submit availability and lead-time inquiries to begin sourcing the XC5VLX110T-1FFG1136I for your design requirements.