XC5VLX110T-2FF1136I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 5455872 110592 1136-BBGA, FCBGA |
|---|---|
| Quantity | 490 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VLX110T-2FF1136I – Virtex®-5 LXT FPGA, 110,592 Logic Elements, 640 I/O, 1136-FCBGA
The XC5VLX110T-2FF1136I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade digital designs. It delivers substantial logic capacity, on-chip memory and a large I/O complement in a 1136-ball FCBGA package for surface-mount system integration.
The device is appropriate for applications that require a combination of high logic element count, significant embedded RAM, and an extensive I/O count within a compact 35 mm × 35 mm package footprint.
Key Features
- Logic Capacity — 110,592 logic elements provide a high-density fabric for complex digital functions and custom logic implementations.
- Logic Blocks — 8,640 logic blocks support modular implementation of logic resources across the device.
- Embedded Memory — Approximately 5.46 Mbits of on-chip RAM to support large buffers, FIFOs and state memory without external components.
- I/O Density — 640 user I/O pins enable broad peripheral interfacing and parallel connectivity for high-bandwidth systems.
- Package — 1136-ball FCBGA (35 × 35 mm) package provides a compact surface-mount form factor suitable for space-constrained boards.
- Power — Core voltage supply range of 0.95 V to 1.05 V for specified core operation.
- Industrial Grade & Temperature Range — Industrial grade device rated for operation from −40°C to 100°C for demanding environments.
- Mounting Type — Surface mount packaging for automated PCB assembly and reliable board-level integration.
Unique Advantages
- High logic density: 110,592 logic elements allow consolidation of multiple functions onto a single device, reducing overall system BOM.
- Substantial on-chip RAM: Approximately 5.46 Mbits of embedded memory reduces the need for external memory devices for many buffering and data-path tasks.
- Extensive I/O capability: 640 I/O pins provide flexibility for connecting many peripherals, interfaces and parallel data channels without additional multiplexing hardware.
- Compact BGA package: The 1136-FCBGA (35×35 mm) footprint balances high pin count with a manageable board area for compact systems.
- Industrial temperature rating: −40°C to 100°C operation supports deployment in systems exposed to wide temperature ranges.
- Surface-mount readiness: FCBGA surface-mount package streamlines automated assembly and yields consistent solder joint reliability.
Why Choose XC5VLX110T-2FF1136I?
The XC5VLX110T-2FF1136I positions itself as a high-capacity, industrial-grade FPGA option for designs that require considerable logic resources, embedded memory and a large number of I/O in a single, surface-mount device. Its combination of 110,592 logic elements, approximately 5.46 Mbits of on-chip RAM and 640 I/O makes it well suited for complex digital systems where integration and board space efficiency matter.
This device is appropriate for engineering teams and procurement seeking a robust FPGA offering from the Virtex®-5 LXT family for long-life industrial applications, providing a balance of integration, thermal range and package density for demanding designs.
Request a quote or submit a quotation request for the XC5VLX110T-2FF1136I to receive pricing and availability information tailored to your project needs.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








