XC5VLX110T-2FF1136I

IC FPGA 640 I/O 1136FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 5455872 110592 1136-BBGA, FCBGA

Quantity 490 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1136-BBGA, FCBGANumber of I/O640Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5455872

Overview of XC5VLX110T-2FF1136I – Virtex®-5 LXT FPGA, 110,592 Logic Elements, 640 I/O, 1136-FCBGA

The XC5VLX110T-2FF1136I is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade digital designs. It delivers substantial logic capacity, on-chip memory and a large I/O complement in a 1136-ball FCBGA package for surface-mount system integration.

The device is appropriate for applications that require a combination of high logic element count, significant embedded RAM, and an extensive I/O count within a compact 35 mm × 35 mm package footprint.

Key Features

  • Logic Capacity — 110,592 logic elements provide a high-density fabric for complex digital functions and custom logic implementations.
  • Logic Blocks — 8,640 logic blocks support modular implementation of logic resources across the device.
  • Embedded Memory — Approximately 5.46 Mbits of on-chip RAM to support large buffers, FIFOs and state memory without external components.
  • I/O Density — 640 user I/O pins enable broad peripheral interfacing and parallel connectivity for high-bandwidth systems.
  • Package — 1136-ball FCBGA (35 × 35 mm) package provides a compact surface-mount form factor suitable for space-constrained boards.
  • Power — Core voltage supply range of 0.95 V to 1.05 V for specified core operation.
  • Industrial Grade & Temperature Range — Industrial grade device rated for operation from −40°C to 100°C for demanding environments.
  • Mounting Type — Surface mount packaging for automated PCB assembly and reliable board-level integration.

Unique Advantages

  • High logic density: 110,592 logic elements allow consolidation of multiple functions onto a single device, reducing overall system BOM.
  • Substantial on-chip RAM: Approximately 5.46 Mbits of embedded memory reduces the need for external memory devices for many buffering and data-path tasks.
  • Extensive I/O capability: 640 I/O pins provide flexibility for connecting many peripherals, interfaces and parallel data channels without additional multiplexing hardware.
  • Compact BGA package: The 1136-FCBGA (35×35 mm) footprint balances high pin count with a manageable board area for compact systems.
  • Industrial temperature rating: −40°C to 100°C operation supports deployment in systems exposed to wide temperature ranges.
  • Surface-mount readiness: FCBGA surface-mount package streamlines automated assembly and yields consistent solder joint reliability.

Why Choose XC5VLX110T-2FF1136I?

The XC5VLX110T-2FF1136I positions itself as a high-capacity, industrial-grade FPGA option for designs that require considerable logic resources, embedded memory and a large number of I/O in a single, surface-mount device. Its combination of 110,592 logic elements, approximately 5.46 Mbits of on-chip RAM and 640 I/O makes it well suited for complex digital systems where integration and board space efficiency matter.

This device is appropriate for engineering teams and procurement seeking a robust FPGA offering from the Virtex®-5 LXT family for long-life industrial applications, providing a balance of integration, thermal range and package density for demanding designs.

Request a quote or submit a quotation request for the XC5VLX110T-2FF1136I to receive pricing and availability information tailored to your project needs.

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