XC5VLX110T-2FFG1738C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 5455872 110592 1738-BBGA, FCBGA |
|---|---|
| Quantity | 1,782 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 680 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 8640 | Number of Logic Elements/Cells | 110592 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5455872 |
Overview of XC5VLX110T-2FFG1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 5455872 110592 1738-BBGA, FCBGA
The XC5VLX110T-2FFG1738C is a Virtex®-5 LXT field programmable gate array from AMD delivered in a high-density FCBGA package. It combines a large number of logic elements, substantial embedded memory, and a high I/O count for complex digital designs.
This device targets commercial applications that require significant on-chip logic and connectivity while operating within a commercial temperature range and a low-voltage core supply.
Key Features
- Logic Capacity — 110,592 logic elements provide substantial programmable logic resource for complex designs and custom hardware acceleration.
- Embedded Memory — Approximately 5.46 Mbits of on-chip RAM (5,455,872 bits) available for buffers, FIFOs, and distributed storage.
- I/O Resources — 680 user I/Os to support extensive peripheral, bus, and interface connectivity requirements.
- Package — 1738-FCBGA / 1738-BBGA package offering a dense, surface-mount footprint; supplier device package listed as 1738-FCBGA (42.5×42.5).
- Core Voltage — Low-voltage core supply range from 950 mV to 1.05 V to match platform power requirements.
- Operating Grade and Temperature — Commercial grade device specified for operation from 0 °C to 85 °C.
- Mounting and Compliance — Surface mount device with RoHS compliance for environmental regulatory alignment.
Unique Advantages
- High integration density: 110,592 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
- Substantial on-chip memory: Approximately 5.46 Mbits of embedded RAM supports high-throughput buffering and on-chip data storage, simplifying external memory requirements.
- Extensive I/O availability: 680 I/Os accommodate complex interfacing and parallel connectivity without additional bridge components.
- Compact, robust package: 1738-FCBGA packaging provides a high-pin-count solution in a surface-mount form factor suitable for dense PCB designs.
- Low-voltage core operation: 950 mV to 1.05 V core supply supports designs targeting efficient power envelopes.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a broad range of commercial applications.
Why Choose XC5VLX110T-2FFG1738C?
The XC5VLX110T-2FFG1738C positions itself as a high-capacity Virtex®-5 LXT FPGA that combines large programmable logic resources, significant embedded memory, and a very high I/O count in a dense FCBGA package. Its electrical and thermal specifications make it appropriate for commercial designs that demand integration and connectivity without sacrificing on-chip resources.
This device is suitable for design teams that need scalable logic density, ample on-chip RAM, and extensive I/O in a surface-mount, RoHS-compliant package. The part offers a clear path to consolidate functions onto a single FPGA for reduced BOM and simplified board-level integration.
Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX110T-2FFG1738C and to discuss how it can meet your project requirements.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








