XC5VLX110T-2FFG1738C

IC FPGA 680 I/O 1738FCBGA
Part Description

Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 5455872 110592 1738-BBGA, FCBGA

Quantity 1,782 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1738-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1738-BBGA, FCBGANumber of I/O680Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs8640Number of Logic Elements/Cells110592
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5455872

Overview of XC5VLX110T-2FFG1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 5455872 110592 1738-BBGA, FCBGA

The XC5VLX110T-2FFG1738C is a Virtex®-5 LXT field programmable gate array from AMD delivered in a high-density FCBGA package. It combines a large number of logic elements, substantial embedded memory, and a high I/O count for complex digital designs.

This device targets commercial applications that require significant on-chip logic and connectivity while operating within a commercial temperature range and a low-voltage core supply.

Key Features

  • Logic Capacity — 110,592 logic elements provide substantial programmable logic resource for complex designs and custom hardware acceleration.
  • Embedded Memory — Approximately 5.46 Mbits of on-chip RAM (5,455,872 bits) available for buffers, FIFOs, and distributed storage.
  • I/O Resources — 680 user I/Os to support extensive peripheral, bus, and interface connectivity requirements.
  • Package — 1738-FCBGA / 1738-BBGA package offering a dense, surface-mount footprint; supplier device package listed as 1738-FCBGA (42.5×42.5).
  • Core Voltage — Low-voltage core supply range from 950 mV to 1.05 V to match platform power requirements.
  • Operating Grade and Temperature — Commercial grade device specified for operation from 0 °C to 85 °C.
  • Mounting and Compliance — Surface mount device with RoHS compliance for environmental regulatory alignment.

Unique Advantages

  • High integration density: 110,592 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Substantial on-chip memory: Approximately 5.46 Mbits of embedded RAM supports high-throughput buffering and on-chip data storage, simplifying external memory requirements.
  • Extensive I/O availability: 680 I/Os accommodate complex interfacing and parallel connectivity without additional bridge components.
  • Compact, robust package: 1738-FCBGA packaging provides a high-pin-count solution in a surface-mount form factor suitable for dense PCB designs.
  • Low-voltage core operation: 950 mV to 1.05 V core supply supports designs targeting efficient power envelopes.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for a broad range of commercial applications.

Why Choose XC5VLX110T-2FFG1738C?

The XC5VLX110T-2FFG1738C positions itself as a high-capacity Virtex®-5 LXT FPGA that combines large programmable logic resources, significant embedded memory, and a very high I/O count in a dense FCBGA package. Its electrical and thermal specifications make it appropriate for commercial designs that demand integration and connectivity without sacrificing on-chip resources.

This device is suitable for design teams that need scalable logic density, ample on-chip RAM, and extensive I/O in a surface-mount, RoHS-compliant package. The part offers a clear path to consolidate functions onto a single FPGA for reduced BOM and simplified board-level integration.

Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX110T-2FFG1738C and to discuss how it can meet your project requirements.

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