XC5VLX110T-2FFG1136I

The XC5VLX110T-2FFG1136I is a Virtex®-5 LXT field programmable gate array (FPGA) from AMD, offered in a 1136-ball FCBGA package. It delivers a high density of programmable logic, substantial embedded memory, and a large I/O count for complex, board-level designs.

Targeted toward industrial applications, this surface-mount FPGA combines approximately 110,592 logic elements, roughly 5.46 Mbits of on-chip RAM, and up to 640 I/Os to support demanding control, processing, and interfacing requirements within its specified industrial temperature and power envelopes.

Key Features

• Core Logic  Approximately 110,592 logic elements provide extensive capacity for implementing complex custom logic, state machines, and control functions.
• Embedded Memory  Total on-chip RAM of 5,455,872 bits (approximately 5.46 Mbits) supports buffering, frame storage, and local data processing without immediate dependence on external memory.
• I/O Density  Up to 640 general-purpose I/Os enable broad connectivity options for sensors, actuators, peripherals, and parallel interfaces on high-pin-count designs.
• Power Supply  Core voltage operating range from 950 mV to 1.05 V permits integration into power-managed systems with defined low-voltage cores.
• Package and Mounting  1136-ball FCBGA (1136-BBGA) package, supplier device package 1136-FCBGA (35×35), provided in a surface-mount form factor for compact, high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compliance  RoHS compliant, enabling use in assemblies requiring hazardous-substance restrictions.

Typical Applications

• Industrial Control: Implement custom control logic and interface boards that require high I/O counts and a wide operating temperature range.
• Data Acquisition and Processing: Use on-chip memory and large logic capacity for buffering, preprocessing, and real-time data handling.
• High-Density Prototyping: Provide a development platform for complex digital systems that need significant programmable logic and plentiful I/Os.

Unique Advantages

• High Logic Capacity: Approximately 110,592 logic elements allow consolidation of multiple functions into a single device, reducing the need for external logic chips.
• Substantial On-Chip Memory: Approximately 5.46 Mbits of embedded RAM supports local buffering and state storage, simplifying memory architecture.
• Extensive I/O Support: Up to 640 I/Os accommodate complex sensor arrays, parallel interfaces, and mixed-signal board partitions.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and offered in a robust FCBGA package suitable for industrial PCBs.
• Compact, Surface-Mount Package: The 1136-ball FCBGA (35×35) enables high-pin-count implementations within constrained PCB footprints.
• Regulatory Compatibility: RoHS compliance helps align designs with environmental and manufacturing standards.

Why Choose XC5VLX110T-2FFG1136I?

The XC5VLX110T-2FFG1136I positions itself as a high-density, industrial-grade FPGA solution that combines large programmable logic resources, multi-megabit embedded memory, and a high I/O count in a single 1136-ball FCBGA package. Its operating temperature range and RoHS compliance make it suitable for industrial deployments where reliability and regulatory adherence are required.

Designed for engineers and system designers who need to consolidate functions, streamline board-level designs, and scale complex digital logic implementations, this AMD Virtex®-5 LXT device offers a balance of integration and robustness for long-term projects backed by a recognized FPGA manufacturer.

Request a quote or submit an RFQ to obtain pricing and availability for XC5VLX110T-2FFG1136I. Our team will respond with current lead times and purchasing options.