XC5VLX110T-2FF1136C

The XC5VLX110T-2FF1136C is a Virtex‑5 LXT Field Programmable Gate Array (FPGA) in a 1136‑ball FCBGA package. It delivers high logic capacity and extensive I/O in a surface‑mount form factor for commercial‑grade applications.

With 110,592 logic elements, approximately 5.46 Mbits of embedded memory and up to 640 I/Os, this device is targeted at designs that require high logic density, substantial on‑chip RAM and broad external connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity  110,592 logic elements provide substantial on‑chip programmable logic for complex combinational and sequential designs.
• Embedded Memory  Approximately 5.46 Mbits of on‑chip RAM to support buffering, packet processing, and local data storage without external memory in some use cases.
• High‑Density I/O  Up to 640 I/O pins enable extensive external interfacing for multi‑channel and high‑connectivity systems.
• Power Supply  Operates from a core voltage range of 950 mV to 1.05 V, suitable for typical FPGA core power domains.
• Package & Mounting  1136‑ball FCBGA (1136‑BBGA) 35×35 mm package in a surface‑mount configuration for compact board integration.
• Operating Conditions  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS‑compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• High‑density digital logic  Implement complex custom logic functions and state machines using the large number of logic elements and embedded RAM.
• Multi‑I/O interfacing  Serve as a central I/O hub for systems requiring many external interfaces, leveraging up to 640 I/Os.
• On‑chip buffering and data handling  Use the embedded memory for local buffering, stream staging, and intermediate data storage to reduce external memory needs.
• Compact board designs  Integrate substantial logic and I/O capability within a 1136‑ball FCBGA package to save PCB area in commercial products.

Unique Advantages

• Substantial on‑chip logic: 110,592 logic elements enable implementation of large, integrated digital functions without partitioning across multiple devices.
• Significant embedded memory: Approximately 5.46 Mbits of RAM supports data buffering and local processing to simplify system memory architecture.
• Extensive external connectivity: Up to 640 I/Os provide flexibility for interfacing with numerous peripherals, sensors, and external logic blocks.
• Compact, surface‑mount package: The 1136‑FCBGA (35×35 mm) package offers a balance of I/O density and board footprint for space‑constrained designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to meet typical commercial product requirements.
• RoHS compliance: Supports lead‑free manufacturing and environmental regulatory needs.

Why Choose XC5VLX110T-2FF1136C?

The XC5VLX110T-2FF1136C positions itself as a high‑capacity, commercially rated FPGA that combines large logic resources, notable embedded memory and broad I/O in a single 1136‑ball FCBGA package. Its voltage and temperature specifications make it suitable for commercial applications that demand substantial on‑chip integration while maintaining a compact board footprint.

This device is well suited for engineering teams building complex digital systems that require high logic density, significant local memory, and many external interfaces, offering a straightforward path to consolidate functionality and reduce board-level component count.

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