XC5VLX110T-1FFG1136CES

The XC5VLX110T-1FFG1136CES is a Virtex®-5 LXT Field Programmable Gate Array (FPGA) offered in a 1136-FCBGA package for surface-mount applications. It delivers a large logic capacity and on-chip memory with extensive I/O capability, targeted at commercial-grade programmable logic designs that require significant logic resources and high pin counts.

Key hardware characteristics include 110,592 logic elements, approximately 5.46 Mbits of embedded memory, up to 640 I/O, a 1136-FCBGA (35×35 mm) package, and a core voltage range of 0.95–1.05 V, with an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  110,592 logic elements (8,640 CLBs) to implement large digital designs and complex logic functions.
• Embedded Memory  Approximately 5.46 Mbits of on-chip RAM for data buffering, FIFOs, and state storage without external memory.
• I/O Resources  Up to 640 I/O pins to support high-density interfacing and multiple parallel connections.
• Power and Voltage  Core supply voltage range of 0.95–1.05 V, allowing precise power design around the FPGA core rails.
• Package and Mounting  1136-BBGA / 1136-FCBGA (35×35 mm) ball-grid array package, designed for surface-mount PCB assembly.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C for standard temperature environments.
• Environmental Compliance  RoHS compliant to meet common lead-free assembly requirements.

Typical Applications

• Programmable Logic and Prototyping  Use the device to implement and iterate large, custom digital logic designs during development and prototyping phases.
• High-Density I/O Systems  Leverage the up to 640 I/O pins for designs requiring many parallel interfaces or complex board-level connectivity.
• Memory-Intensive Designs  Embedded memory (approximately 5.46 Mbits) supports buffering, packet staging, and intermediate data storage within the FPGA fabric.

Unique Advantages

• Large Logic Resource: 110,592 logic elements enable implementation of sizable and complex logic networks without partitioning across multiple devices.
• Significant On-Chip Memory: Approximately 5.46 Mbits of embedded RAM reduces dependence on external memory for many common buffering and state-storage tasks.
• Extensive I/O Capability: Up to 640 I/O pins support high pin-count designs and simplify board-level integration with multiple peripherals.
• Compact BGA Packaging: 1136-FCBGA (35×35 mm) provides a high-density package suitable for surface-mount assembly while consolidating pins in a single footprint.
• Commercial-Grade Operation: Rated for 0 °C to 85 °C, matching typical commercial-environment deployment requirements.
• RoHS Compliant: Meets lead-free manufacturing standards for environmental compliance in mainstream production.

Why Choose XC5VLX110T-1FFG1136CES?

The XC5VLX110T-1FFG1136CES positions itself as a robust commercial-grade FPGA option for designs that demand substantial logic capacity, embedded memory, and high I/O counts within a single 1136-FCBGA package. Its combination of 110,592 logic elements and approximately 5.46 Mbits of on-chip RAM supports consolidated, high-density digital designs and system-level integration.

This device suits engineering teams and procurement groups seeking a programmable logic solution that balances large resource counts, a compact BGA footprint, and RoHS compliance for standard commercial applications. It provides scalability for complex designs while aligning with common power and temperature design constraints.

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