XC5VLX110T-3FFG1136C

The XC5VLX110T-3FFG1136C is a Virtex®-5 LXT Field Programmable Gate Array from AMD supplied in a 1136-FCBGA (35×35 mm) package. It delivers substantial on-chip logic and memory resources with extensive I/O capability for complex, high-density digital designs.

Designed for commercial-temperature applications, this surface-mount FPGA combines approximately 110,592 logic elements, about 5.46 Mbits of embedded memory, and up to 640 I/O pins, supporting designs that require high integration and dense connectivity.

Key Features

• Core Logic Approximately 110,592 logic elements to implement complex custom digital logic and state machines.
• Embedded Memory Approximately 5.46 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing.
• I/O Density Up to 640 I/O pins to support wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting 1136-BBGA, FCBGA package (1136-FCBGA, 35×35 mm) optimized for surface-mount PCB assembly.
• Power Core voltage supply range of 950 mV to 1.05 V to match targeted power domains and system rails.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance RoHS-compliant construction for environmental and manufacturing compliance.

Typical Applications

• High-density digital logic — Implement large-scale custom logic functions and finite-state machines using approximately 110,592 logic elements.
• Memory-intensive processing — Use the approximately 5.46 Mbits of embedded RAM for buffering, data aggregation, and intermediate storage tasks.
• Dense I/O platforms — Support systems that require up to 640 I/O signals for parallel interfaces, multi-channel I/O, or complex peripheral connectivity.

Unique Advantages

• High logic capacity: Approximately 110,592 logic elements enable implementation of large custom designs without immediate partitioning across devices.
• Substantial on-chip RAM: Approximately 5.46 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
• Extensive I/O: Up to 640 I/O pins provide flexibility for wide buses, multiple interfaces, and dense system integration.
• Compact FCBGA package: The 1136-FCBGA (35×35 mm) package supports high-density PCB layouts while enabling surface-mount assembly.
• Controlled core voltage: Operation within a 950 mV to 1.05 V supply range aligns with common low-voltage core domains for power-managed systems.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for general-purpose electronic applications.

Why Choose XC5VLX110T-3FFG1136C?

The XC5VLX110T-3FFG1136C positions itself as a high-capacity, commercially rated FPGA for designs that demand large logic resources, meaningful on-chip memory, and dense I/O in a compact FCBGA footprint. Its combination of approximately 110,592 logic elements, about 5.46 Mbits of embedded RAM, and up to 640 I/O pins makes it suitable for complex digital implementations requiring on-chip integration and connectivity.

Backed by AMD manufacturing and RoHS compliance, this Virtex®-5 LXT device is intended for engineering teams and procurement focused on scalable, reliable FPGA solutions within commercial temperature ranges, where integration density and I/O capability are key selection criteria.

Request a quote or submit an inquiry for XC5VLX110T-3FFG1136C to receive pricing, lead-time, and availability details from our sales team.