XC5VLX155-1FFG1153I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1153-BBGA, FCBGA |
|---|---|
| Quantity | 541 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1153-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1153-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7077888 |
Overview of XC5VLX155-1FFG1153I – Virtex®-5 LX FPGA, 1153-FCBGA (35×35), Industrial Grade
The XC5VLX155-1FFG1153I is a Virtex‑5 LX field programmable gate array (FPGA) in a 1153‑ball FCBGA package configured for surface mount. It delivers high logic capacity and on‑chip memory with up to 155,648 logic elements and approximately 7.08 Mbits of embedded RAM.
With 800 user I/O, a supply voltage window of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 100 °C, this industrial‑grade device is targeted at designs that need large programmable resources, extensive I/O, and robust temperature capability.
Key Features
- Core Logic Provides 155,648 logic elements and 12,160 CLBs for large-scale programmable logic integration and complex digital implementations.
- Embedded Memory Approximately 7.08 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage for high‑throughput designs.
- High I/O Count Up to 800 user I/O pins to accommodate dense external interfaces and multiple parallel buses.
- Power Supply Operates from a core voltage range of 0.95 V to 1.05 V to match low‑voltage system architectures.
- Package & Mounting 1153‑ball FCBGA package (35 × 35 mm) in a surface‑mount form factor for compact board integration.
- Industrial Temperature Range Qualified for operation from −40 °C to 100 °C, suitable for temperature‑challenging environments.
- RoHS Compliant Manufactured to meet RoHS requirements for environmental compliance.
Typical Applications
- High‑density digital processing Large logic resources and embedded RAM enable complex processing engines, data path implementations, and custom accelerators.
- Multi‑interface systems With up to 800 I/O, the device supports designs that require many parallel or mixed I/O interfaces.
- Industrial control and automation Industrial temperature rating and high logic capacity suit control systems, motion control, and real‑time processing tasks.
- Prototyping and system integration Surface‑mount FCBGA packaging and dense logic/memory resources allow compact prototype and production designs that consolidate functionality.
Unique Advantages
- Highly integrated logic and memory: Combines 155,648 logic elements with approximately 7.08 Mbits of embedded RAM to reduce external components and simplify designs.
- Extensive I/O capability: Up to 800 user I/O supports complex board-level interfacing without additional bridging devices.
- Industrial thermal range: Rated for −40 °C to 100 °C operation, enabling deployment in temperature‑stressed environments.
- Compact, manufacturable package: 1153‑ball FCBGA (35 × 35 mm) surface‑mount package suitable for dense board layouts and automated assembly.
- Low‑voltage core operation: 0.95 V to 1.05 V supply range aligns with low‑voltage system power architectures to help manage power distribution.
Why Choose XC5VLX155-1FFG1153I?
The XC5VLX155-1FFG1153I positions itself as a high‑capacity, industrial‑grade programmable logic device for designs that demand extensive logic resources, significant embedded memory, and a large number of I/O. Its FCBGA package and surface‑mount form factor enable compact, production‑ready board implementations.
Engineers and procurement teams looking for scalable programmable logic in temperature‑challenging environments will find the combination of logic density, on‑chip RAM, and 800 I/O attractive for consolidating functions and reducing system complexity.
Request a quote or submit an inquiry today to obtain pricing and availability for the XC5VLX155-1FFG1153I.

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