XC5VLX155-1FFG1153I

IC FPGA 800 I/O 1153FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1153-BBGA, FCBGA

Quantity 541 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1153-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1153-BBGA, FCBGANumber of I/O800Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12160Number of Logic Elements/Cells155648
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7077888

Overview of XC5VLX155-1FFG1153I – Virtex®-5 LX FPGA, 1153-FCBGA (35×35), Industrial Grade

The XC5VLX155-1FFG1153I is a Virtex‑5 LX field programmable gate array (FPGA) in a 1153‑ball FCBGA package configured for surface mount. It delivers high logic capacity and on‑chip memory with up to 155,648 logic elements and approximately 7.08 Mbits of embedded RAM.

With 800 user I/O, a supply voltage window of 0.95 V to 1.05 V, and an operating temperature range of −40 °C to 100 °C, this industrial‑grade device is targeted at designs that need large programmable resources, extensive I/O, and robust temperature capability.

Key Features

  • Core Logic  Provides 155,648 logic elements and 12,160 CLBs for large-scale programmable logic integration and complex digital implementations.
  • Embedded Memory  Approximately 7.08 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage for high‑throughput designs.
  • High I/O Count  Up to 800 user I/O pins to accommodate dense external interfaces and multiple parallel buses.
  • Power Supply  Operates from a core voltage range of 0.95 V to 1.05 V to match low‑voltage system architectures.
  • Package & Mounting  1153‑ball FCBGA package (35 × 35 mm) in a surface‑mount form factor for compact board integration.
  • Industrial Temperature Range  Qualified for operation from −40 °C to 100 °C, suitable for temperature‑challenging environments.
  • RoHS Compliant  Manufactured to meet RoHS requirements for environmental compliance.

Typical Applications

  • High‑density digital processing  Large logic resources and embedded RAM enable complex processing engines, data path implementations, and custom accelerators.
  • Multi‑interface systems  With up to 800 I/O, the device supports designs that require many parallel or mixed I/O interfaces.
  • Industrial control and automation  Industrial temperature rating and high logic capacity suit control systems, motion control, and real‑time processing tasks.
  • Prototyping and system integration  Surface‑mount FCBGA packaging and dense logic/memory resources allow compact prototype and production designs that consolidate functionality.

Unique Advantages

  • Highly integrated logic and memory: Combines 155,648 logic elements with approximately 7.08 Mbits of embedded RAM to reduce external components and simplify designs.
  • Extensive I/O capability: Up to 800 user I/O supports complex board-level interfacing without additional bridging devices.
  • Industrial thermal range: Rated for −40 °C to 100 °C operation, enabling deployment in temperature‑stressed environments.
  • Compact, manufacturable package: 1153‑ball FCBGA (35 × 35 mm) surface‑mount package suitable for dense board layouts and automated assembly.
  • Low‑voltage core operation: 0.95 V to 1.05 V supply range aligns with low‑voltage system power architectures to help manage power distribution.

Why Choose XC5VLX155-1FFG1153I?

The XC5VLX155-1FFG1153I positions itself as a high‑capacity, industrial‑grade programmable logic device for designs that demand extensive logic resources, significant embedded memory, and a large number of I/O. Its FCBGA package and surface‑mount form factor enable compact, production‑ready board implementations.

Engineers and procurement teams looking for scalable programmable logic in temperature‑challenging environments will find the combination of logic density, on‑chip RAM, and 800 I/O attractive for consolidating functions and reducing system complexity.

Request a quote or submit an inquiry today to obtain pricing and availability for the XC5VLX155-1FFG1153I.

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