XC5VLX155-2FF1760I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1760-BBGA, FCBGA |
|---|---|
| Quantity | 808 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7077888 |
Overview of XC5VLX155-2FF1760I – Virtex®-5 LX Field Programmable Gate Array (FPGA), 1760-FCBGA, Industrial
The XC5VLX155-2FF1760I is a Virtex®-5 LX field programmable gate array (FPGA) offered in a 1760-ball FCBGA package. It delivers large logic capacity and a high I/O count for designs that require extensive programmable logic, on-chip memory, and dense external connectivity.
With 155,648 logic elements, approximately 7.08 Mbits of embedded memory and up to 800 I/O signals, this device targets industrial applications and complex system integration where significant programmable logic and I/O resources are required. The device is specified for core voltages from 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C.
Key Features
- Logic Capacity 155,648 logic elements and 12,160 CLBs provide extensive resources for implementing large custom logic functions and state machines.
- Embedded Memory Approximately 7.08 Mbits of on-chip RAM for buffering, FIFOs, and localized data storage.
- I/O Integration Up to 800 I/O pins to support dense external interfacing and multiple parallel connections.
- Power Requirements Core supply specified from 0.95 V to 1.05 V to match system power-rail design constraints.
- Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) package, surface-mount construction, suitable for compact, high-density board layouts.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C and manufactured to an industrial grade.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control & Automation — Implement complex control logic, motor drives, and sensor interfacing leveraging large logic capacity and industrial temperature rating.
- Communications & Networking — Support packet processing, protocol bridging and multi-channel interfaces using abundant logic and I/O resources.
- Prototyping & System Integration — Field programmable architecture allows iterative hardware design, integration of custom peripherals, and on-board validation.
- High-density I/O Systems — Aggregate and route large numbers of discrete signals or parallel buses using up to 800 I/Os.
Unique Advantages
- Large Logic Resource Pool: 155,648 logic elements and 12,160 CLBs enable implementation of sizeable custom logic blocks without immediate need for multiple devices.
- Significant On-chip Memory: Approximately 7.08 Mbits of embedded RAM reduces reliance on external memory for mid-sized buffering and state storage.
- High I/O Density: Up to 800 I/Os simplify board-level routing for interfaces, sensor arrays, and parallel data paths.
- Industrial-grade Operation: Specified for −40 °C to 100 °C, making the device suitable for a wide range of industrial environments.
- Compact, Surface-mount Package: 1760-FCBGA (42.5 × 42.5 mm) enables high-density PCB implementations while maintaining a large internal resource set.
Why Choose XC5VLX155-2FF1760I?
The XC5VLX155-2FF1760I positions itself as a high-capacity, industrial-grade Virtex®-5 LX FPGA option for designs that require substantial programmable logic, on-chip RAM and extensive I/O. The combination of 155,648 logic elements, approximately 7.08 Mbits of embedded memory and up to 800 I/Os supports complex system integration and reduces the need for multiple discrete components.
This device is suited to engineering teams developing industrial control systems, communications equipment, and high-density I/O applications that demand scalable programmable logic within a robust temperature range. Its surface-mount FCBGA package provides a compact platform for board-level designs while maintaining the logic and memory resources necessary for long-term scalability.
Request a quote or submit an inquiry to discuss availability, pricing and delivery for the XC5VLX155-2FF1760I. Our team can provide the details you need to evaluate this FPGA for your next design.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








