XC5VLX155-2FF1760I

IC FPGA 800 I/O 1760FCBGA
Part Description

Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1760-BBGA, FCBGA

Quantity 808 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O800Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12160Number of Logic Elements/Cells155648
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7077888

Overview of XC5VLX155-2FF1760I – Virtex®-5 LX Field Programmable Gate Array (FPGA), 1760-FCBGA, Industrial

The XC5VLX155-2FF1760I is a Virtex®-5 LX field programmable gate array (FPGA) offered in a 1760-ball FCBGA package. It delivers large logic capacity and a high I/O count for designs that require extensive programmable logic, on-chip memory, and dense external connectivity.

With 155,648 logic elements, approximately 7.08 Mbits of embedded memory and up to 800 I/O signals, this device targets industrial applications and complex system integration where significant programmable logic and I/O resources are required. The device is specified for core voltages from 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity 155,648 logic elements and 12,160 CLBs provide extensive resources for implementing large custom logic functions and state machines.
  • Embedded Memory Approximately 7.08 Mbits of on-chip RAM for buffering, FIFOs, and localized data storage.
  • I/O Integration Up to 800 I/O pins to support dense external interfacing and multiple parallel connections.
  • Power Requirements Core supply specified from 0.95 V to 1.05 V to match system power-rail design constraints.
  • Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) package, surface-mount construction, suitable for compact, high-density board layouts.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C and manufactured to an industrial grade.
  • Regulatory RoHS compliant.

Typical Applications

  • Industrial Control & Automation — Implement complex control logic, motor drives, and sensor interfacing leveraging large logic capacity and industrial temperature rating.
  • Communications & Networking — Support packet processing, protocol bridging and multi-channel interfaces using abundant logic and I/O resources.
  • Prototyping & System Integration — Field programmable architecture allows iterative hardware design, integration of custom peripherals, and on-board validation.
  • High-density I/O Systems — Aggregate and route large numbers of discrete signals or parallel buses using up to 800 I/Os.

Unique Advantages

  • Large Logic Resource Pool: 155,648 logic elements and 12,160 CLBs enable implementation of sizeable custom logic blocks without immediate need for multiple devices.
  • Significant On-chip Memory: Approximately 7.08 Mbits of embedded RAM reduces reliance on external memory for mid-sized buffering and state storage.
  • High I/O Density: Up to 800 I/Os simplify board-level routing for interfaces, sensor arrays, and parallel data paths.
  • Industrial-grade Operation: Specified for −40 °C to 100 °C, making the device suitable for a wide range of industrial environments.
  • Compact, Surface-mount Package: 1760-FCBGA (42.5 × 42.5 mm) enables high-density PCB implementations while maintaining a large internal resource set.

Why Choose XC5VLX155-2FF1760I?

The XC5VLX155-2FF1760I positions itself as a high-capacity, industrial-grade Virtex®-5 LX FPGA option for designs that require substantial programmable logic, on-chip RAM and extensive I/O. The combination of 155,648 logic elements, approximately 7.08 Mbits of embedded memory and up to 800 I/Os supports complex system integration and reduces the need for multiple discrete components.

This device is suited to engineering teams developing industrial control systems, communications equipment, and high-density I/O applications that demand scalable programmable logic within a robust temperature range. Its surface-mount FCBGA package provides a compact platform for board-level designs while maintaining the logic and memory resources necessary for long-term scalability.

Request a quote or submit an inquiry to discuss availability, pricing and delivery for the XC5VLX155-2FF1760I. Our team can provide the details you need to evaluate this FPGA for your next design.

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