XC5VLX155-3FF1153C

The XC5VLX155-3FF1153C is a Virtex®-5 LX field programmable gate array (FPGA) from AMD, offered in a 1153-ball FCBGA package. It provides a high count of programmable logic and embedded memory, along with a large number of I/O pins, for designs requiring significant on-chip resources.

Designed for commercial-grade applications, this device targets systems that need substantial logic density, abundant embedded RAM, and flexible I/O connectivity while operating within standard commercial temperature and supply ranges.

Key Features

• High Logic Capacity — 155,648 logic elements to support complex digital designs and large-scale HDL implementations.
• Embedded Memory — Approximately 7.08 Mbits of on-chip RAM to support buffering, data storage, and memory-intensive processing.
• Abundant I/O — 800 available I/O pins to enable dense connectivity with external devices, sensors, and peripherals.
• Package & Mounting — 1153-BBGA / 1153-FCBGA (35×35) package in a surface-mount form factor for compact board-level integration.
• Power — Core supply range of 0.950 V to 1.05 V to match system power-domain requirements.
• Operating Range — Commercial operating temperature range of 0 °C to 85 °C for typical commercial applications.
• Compliance — RoHS-compliant build to meet common environmental directives for electronic assemblies.

Typical Applications

• High-density digital processing — Use the large logic capacity for complex state machines, custom processors, and parallel compute pipelines.
• Memory-intensive algorithms — Leverage approximately 7.08 Mbits of embedded RAM for buffering, packet processing, and temporary data storage.
• I/O-heavy interfaces — Deploy in systems requiring many external connections such as multi-channel data acquisition, bridging, or high-pin-count control applications.
• Prototype and system validation — Suitable for validating large HDL designs that require a production-like, high-density FPGA resource set.

Unique Advantages

• Large on-chip logic — 155,648 logic elements reduce the need for multiple FPGAs and simplify board-level partitioning.
• Significant embedded RAM — Approximately 7.08 Mbits of RAM supports local buffering and reduces external memory dependence.
• Extensive I/O count — 800 I/Os enable direct connectivity to many peripherals and parallel interfaces without heavy external multiplexing.
• Compact FCBGA package — 1153-ball FCBGA (35×35) offers a high-pin-density solution for space-constrained PCBs.
• Commercial-grade suitability — Rated for 0 °C to 85 °C operation to meet mainstream commercial product requirements.
• RoHS compliant — Conforms to RoHS for use in environments requiring lead-free components.

Why Choose XC5VLX155-3FF1153C?

The XC5VLX155-3FF1153C balances very high logic capacity, substantial embedded memory, and extensive I/O in a single commercial-grade FPGA package. Its combination of 155,648 logic elements, approximately 7.08 Mbits of on-chip RAM, and 800 I/Os makes it suitable for complex digital systems that demand integrated resources and dense connectivity.

This device is a practical choice for engineering teams building high-density, memory-aware digital solutions who need a surface-mount FCBGA package and standard commercial operating conditions. Its specifications support scalable designs that consolidate logic and memory on-chip, simplifying board-level architecture and component count.

Request a quote or submit a pricing inquiry to evaluate the XC5VLX155-3FF1153C for your next high-density FPGA design.