XC5VLX155-2FFG1153C

The XC5VLX155-2FFG1153C is a Virtex‑5 LX series field programmable gate array (FPGA) from AMD. It delivers a high count of logic resources, embedded memory and I/O in a 1153‑ball FCBGA surface‑mount package for compact, high‑density system designs.

With 155,648 logic elements, approximately 7.08 Mbits of on‑chip RAM and up to 800 I/O pins, this device targets designs that require significant programmable logic capacity, large embedded memory and broad external connectivity while operating within a commercial temperature range.

Key Features

• Core Logic: 155,648 logic elements providing substantial programmable logic capacity for complex digital functions and parallel processing.
• Embedded Memory: Approximately 7.08 Mbits of on‑chip RAM to support buffering, lookup tables and local data storage.
• I/O Density: Up to 800 I/O pins to enable extensive external interfacing and high‑pin‑count system integration.
• Package & Mounting: 1153‑BBGA (1153‑FCBGA, 35×35) surface‑mount package suitable for space‑efficient board layouts.
• Power: Core voltage supply range of 0.95 V to 1.05 V to support standard Virtex‑5 core power domains.
• Operating Range & Grade: Commercial grade operation from 0 °C to 85 °C; RoHS compliant for lead‑free assembly.

Typical Applications

• High‑density digital processing: Implements large-scale logic designs that require many programmable elements and substantial on‑chip memory.
• Custom hardware acceleration: Builds accelerators and datapath engines that benefit from the device’s large logic and RAM resources.
• Complex I/O systems: Interfaces with numerous external devices and buses using the device’s up to 800 I/O pins for rich connectivity.

Unique Advantages

• High logic capacity: 155,648 logic elements allow consolidation of complex functions into a single FPGA, reducing overall system component count.
• Significant embedded memory: Approximately 7.08 Mbits of on‑chip RAM supports large buffers and state storage without immediate need for external memory.
• Extensive I/O: Up to 800 I/O pins provide flexibility for multi‑interface designs and high‑pin‑count integrations.
• Compact FCBGA package: 1153‑ball FCBGA (35×35) supports dense board layouts and surface‑mount assembly for space‑constrained applications.
• Commercial operating range and RoHS compliance: Designed for commercial temperature environments (0 °C to 85 °C) and compliant with RoHS requirements for lead‑free manufacturing.
• Predictable core power: Narrow core voltage range (0.95–1.05 V) aids power‑rail planning and integration into standard FPGA power architectures.

Why Choose XC5VLX155-2FFG1153C?

The XC5VLX155-2FFG1153C combines a large pool of programmable logic, substantial embedded memory and high I/O count in a single AMD Virtex‑5 LX family device, enabling consolidation of complex digital systems. Its FCBGA surface‑mount package and commercial temperature rating make it suitable for compact, board‑level designs that require significant on‑chip resources.

Choose this part when your design demands high logic density, extensive local RAM and broad external connectivity while remaining within commercial operating conditions—delivering scalability and integration for demanding FPGA‑based projects.

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