XC5VLX155-2FF1153C

The XC5VLX155-2FF1153C is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC optimized for high-density digital designs. It delivers a large logic fabric combined with substantial embedded RAM and extensive I/O in a 1153-FCBGA package for compact system integration.

Designed for commercial-grade applications, this device targets designs that require significant on-chip logic and memory resources while maintaining a narrow core voltage range and RoHS compliance for modern manufacturing flows.

Key Features

• Core Logic  155,648 logic elements provide a high-capacity programmable fabric for complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 7.08 Mbits of on-chip RAM (7,077,888 bits) supports buffers, FIFOs and fast data storage close to logic.
• I/O Density  800 user I/O pins accommodate wide parallel interfaces and high pin-count system connectivity.
• Package  1153-FCBGA (35×35) package in an FCBGA/BBGA case enables a compact board footprint with surface-mount assembly.
• Power  Core voltage supply range of 0.95 V to 1.05 V supports regulated low-voltage power domains for the FPGA core.
• Temperature and Grade  Commercial operating range from 0 °C to 85 °C suitable for standard commercial applications.
• Compliance  RoHS compliant for lead-free manufacturing and environmental compliance in production.

Typical Applications

• Custom Digital Logic  Implement bespoke hardware functions and protocol handling using the large logic element count and on-chip memory.
• High-Density I/O Systems  Support wide parallel buses, multi-channel interfaces or dense signal routing with 800 I/O pins.
• Embedded Memory-Intensive Designs  Use the approximately 7.08 Mbits of embedded RAM for buffering, packet storage or localized data processing.

Unique Advantages

• High Logic Capacity: 155,648 logic elements enable implementation of large, complex designs without external glue logic.
• Substantial On-Chip RAM: Approximately 7.08 Mbits of embedded memory reduces dependence on external memory for many use cases.
• Extensive I/O Count: 800 I/O pins provide flexibility for multi-interface and multi-channel applications, simplifying board-level design.
• Compact, Surface-Mount Package: 1153-FCBGA (35×35) package supports high-density assemblies while conserving PCB area.
• Controlled Core Voltage: Narrow supply range (0.95–1.05 V) helps ensure stable core operation within specified power domains.
• RoHS Compliant: Facilitates integration into lead-free manufacturing processes.

Why Choose XC5VLX155-2FF1153C?

The XC5VLX155-2FF1153C combines a very large logic element count with several megabits of embedded RAM and a high I/O count in a compact FCBGA package, making it well suited to commercial designs that demand dense programmable logic and on-chip memory. Its electrical and thermal specifications provide a clear basis for system-level power and thermal planning.

This device is appropriate for development teams and procurement groups targeting complex digital systems that require scalability and integration of numerous interfaces, while maintaining compliance with RoHS and commercial temperature requirements.

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