XC5VLX155-1FFG1760I
| Part Description |
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 800 7077888 155648 1760-BBGA, FCBGA |
|---|---|
| Quantity | 921 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 800 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7077888 |
Overview of XC5VLX155-1FFG1760I – Virtex®-5 LX FPGA, 1760-FCBGA, Industrial Grade
The XC5VLX155-1FFG1760I is a Virtex®-5 LX field programmable gate array (FPGA) from AMD designed for high-density, programmable logic applications. It provides substantial on-chip resources—155,648 logic elements and approximately 7.08 Mbits of embedded memory—together with 800 I/O for designs that require large logic capacity and extensive external interfacing.
Specified for industrial use with an operating range of -40 °C to 100 °C and RoHS compliance, the device is supplied in a 1760-FCBGA package and is intended for surface-mount PCB assembly within systems that demand scalable programmable logic and robust environmental tolerances.
Key Features
- Core Logic 155,648 logic elements provide a high-capacity programmable fabric for complex digital designs and custom hardware implementations.
- Embedded Memory Approximately 7.08 Mbits of on-chip RAM to support buffers, lookup tables, and memory-intensive algorithms without relying solely on external memory.
- I/O Density 800 I/O pins enable extensive external connectivity for sensors, peripherals, and high-pin-count interfaces.
- Power Supply Core voltage range of 950 mV to 1.05 V allows designers to plan power delivery and thermal budgets around a defined supply window.
- Package and Mounting 1760-FCBGA package (1760-BBGA form) with surface-mount mounting; supplier device package listed as 1760-FCBGA (42.5×42.5).
- Industrial Temperature Range Rated for operation from -40 °C to 100 °C to meet demanding environmental requirements.
- Regulatory Compliance RoHS compliant for use in assemblies requiring restricted-substance compliance.
Typical Applications
- High-density logic systems Use the device where large numbers of logic elements and embedded memory are required to implement complex, custom digital functions.
- I/O-intensive platforms Leverage 800 I/O pins for designs that need broad external connectivity for sensors, peripherals, or parallel interfaces.
- Industrial controllers and equipment Deploy the FPGA in industrial systems that benefit from programmable hardware and an operating range of -40 °C to 100 °C.
Unique Advantages
- High logic capacity: 155,648 logic elements enable integration of large, complex logic blocks on a single device, reducing external component count.
- Substantial on-chip memory: Approximately 7.08 Mbits of embedded RAM supports data buffering and local storage for performance-sensitive functions.
- Extensive I/O count: 800 I/O provide flexibility for multi-channel and multi-interface designs without immediate dependence on external GPIO expanders.
- Industrial-grade operating range: Specified -40 °C to 100 °C operation aligns the device with applications that require extended environmental tolerance.
- Defined power envelope: Core voltage specified from 950 mV to 1.05 V helps streamline power-supply design and system integration.
- RoHS compliant: Facilitates inclusion in assemblies where restricted-substance compliance is required.
Why Choose XC5VLX155-1FFG1760I?
The XC5VLX155-1FFG1760I brings together a large logic fabric, significant embedded memory, and a high I/O count in a single 1760-FCBGA surface-mount package, making it well suited to complex, high-density programmable designs. Its industrial temperature rating and RoHS compliance provide predictable behavior in demanding environments and support regulatory needs.
This device is positioned for engineering teams and procurement focused on scalable programmable solutions that require substantial on-chip resources and robust environmental specifications, backed by AMD’s Virtex-5 family tooling and documentation.
Request a quote or submit an inquiry to receive pricing and availability for the XC5VLX155-1FFG1760I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








