XC5VLX155-2FFG1153I

The XC5VLX155-2FFG1153I is a Virtex®-5 LX Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 1153-FCBGA (35×35) surface-mount package. This device integrates a high logic density—155,648 logic elements—and substantial on-chip memory, making it suitable for complex, reconfigurable digital designs that require many I/O and industrial temperature operation.

Key on-chip resources include 12,160 CLBs, approximately 7.08 Mbits of embedded memory, and 800 user I/O pins. The device operates from a core supply range of 950 mV to 1.05 V and is specified for an operating temperature range of -40 °C to 100 °C. RoHS compliance is provided.

Key Features

• Core Logic  155,648 logic elements and 12,160 CLBs provide high-density programmable logic capacity for large-scale designs.
• Embedded Memory  Approximately 7.08 Mbits of on-chip RAM to support buffering, state storage, and data-path implementations without external memory for many functions.
• I/O Capacity  800 user I/O pins enable extensive interfacing to peripherals, sensors, and external devices.
• Power  Core supply range from 950 mV to 1.05 V to match system power budgets and core voltage requirements.
• Package & Mounting  1153-ball FCBGA surface-mount package (1153-FCBGA, 35×35) for compact board-level integration and high pin-count routing.
• Temperature & Compliance  Rated for industrial operation from -40 °C to 100 °C and RoHS compliant for environmental regulatory requirements.

Unique Advantages

• High logic density: 155,648 logic elements enable implementation of complex algorithms and large custom logic blocks on a single device, reducing board-level complexity.
• Generous embedded memory: Approximately 7.08 Mbits of on-chip RAM supports data buffering and memory-intensive functions without immediate reliance on external RAM.
• Extensive I/O availability: 800 I/O pins provide flexible connectivity options for multi-channel interfaces and high-peripheral counts.
• Industrial temperature rating: -40 °C to 100 °C specification supports deployment in temperature-challenging environments.
• Compact, high-pin-count package: 1153-FCBGA (35×35) offers a dense footprint for high-performance designs while maintaining a surface-mount form factor.
• Regulatory compliance: RoHS compliance supports environmentally conscious procurement and manufacturing processes.

Why Choose XC5VLX155-2FFG1153I?

The XC5VLX155-2FFG1153I delivers a combination of large programmable logic capacity, substantial embedded memory, and high I/O count in a single industrial-temperature FPGA package. It is positioned for high-density, reconfigurable designs where on-chip resources and reliable operation across -40 °C to 100 °C are required.

Engineers and procurement teams selecting this device gain a scalable, RoHS-compliant FPGA platform with clear hardware resource metrics—logic elements, CLBs, embedded RAM, and I/O—that simplify system-level tradeoffs and long-term design planning.

Request a quote or submit an RFQ to receive pricing and availability for the XC5VLX155-2FFG1153I. Our team can provide lead-time information and support for your procurement needs.