XC5VLX155T-1FF1136I
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,300 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX155T-1FF1136I – Virtex®-5 LXT FPGA, 155,648 Logic Elements, 1136-FCBGA
The XC5VLX155T-1FF1136I is a Virtex®-5 LXT field-programmable gate array (FPGA) IC from AMD, configured in a 1136-ball FCBGA package. It provides substantial on-chip logic and memory capacity along with a high I/O count and industrial-grade operating range.
With 155,648 logic elements, approximately 7.8 Mbits of embedded memory, and 640 I/O pins, this device is suited to designs that require large programmable logic capacity, significant embedded RAM, and extensive external connectivity while operating at a core supply between 0.95 V and 1.05 V.
Key Features
- Core Logic Capacity 155,648 logic elements and 12,160 CLBs provide substantial programmable logic resources for complex digital designs.
- Embedded Memory Approximately 7.8 Mbits of on-chip RAM to support buffering, routing tables, and state storage for logic-intensive applications.
- I/O Density 640 user I/O pins enable broad external interfacing and connectivity to peripherals, memory, and high-speed interfaces.
- Power and Supply Core voltage supply range of 0.95 V to 1.05 V to match targeted system power rails and design constraints.
- Package and Mounting 1136-FCBGA (35 × 35 mm) package in surface-mount format for high-density board integration.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in a wide range of environmental conditions.
- Regulatory Compliance RoHS compliant to support lead-free manufacturing processes.
Typical Applications
- High-density digital systems Use the large logic element count and CLB resources for complex state machines, custom accelerators, and large FPGA-based controllers.
- Memory-intensive designs Leverage approximately 7.8 Mbits of embedded RAM for buffering, packet queues, and on-chip data storage.
- I/O-intensive interfaces Employ the 640 I/Os for protocol bridging, multiport connectivity, and interfacing to a variety of external devices and peripherals.
Unique Advantages
- Large programmable resource pool: The combination of 155,648 logic elements and 12,160 CLBs simplifies integration of complex logic functions on a single device, reducing system component count.
- Substantial embedded memory: Approximately 7.8 Mbits of on-chip RAM supports local buffering and data staging without immediate external memory dependence.
- High I/O capacity: 640 available I/Os enable broad external connectivity, allowing flexible interface routing and multiple peripheral connections.
- Industrial temperature rating: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Compact FCBGA package: The 1136-ball FCBGA (35 × 35 mm) delivers high I/O and routing density suitable for space-constrained PCBs.
- RoHS compliant: Supports lead-free manufacturing requirements.
Why Choose XC5VLX155T-1FF1136I?
The XC5VLX155T-1FF1136I positions itself as a high-capacity Virtex-5 LXT FPGA offering a large quantity of logic elements, significant on-chip memory, and extensive I/O in an industry-standard FCBGA package. Its industrial temperature range and RoHS compliance make it appropriate for demanding applications that require robust operating conditions and lead-free assembly.
This device is well suited for engineers and system designers who need to consolidate complex logic, support substantial on-chip buffering, and provide broad external connectivity in a single programmable device. Its combination of resources supports scalable design choices and integration strategies for long-term deployments.
Request a quote or submit a quote request today to obtain pricing and availability for the XC5VLX155T-1FF1136I. Our team will respond with the details you need to move your design forward.

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