XC5VLX155T-1FFG1136C

The XC5VLX155T-1FFG1136C is a Virtex®-5 LXT field programmable gate array (FPGA) IC from AMD. It provides a large logic fabric, substantial embedded RAM, and a high I/O count in a 1136-ball FCBGA package for surface-mount board integration.

This device is suited to designs that require significant on-chip logic capacity, embedded memory and dense connectivity while operating within commercial temperature ranges.

Key Features

• Core Logic Approximately 155,648 logic elements for implementing complex digital functions and wide parallel datapaths.
• Embedded Memory Approximately 7.8 Mbits of on-chip RAM to support buffering, lookup tables and intermediate storage without external memory.
• I/O Density 640 user I/O pins to support multiple parallel interfaces and high-pin-count board connections.
• Package 1136-ball BGA (1136-FCBGA, 35×35 mm footprint), optimized for surface-mount assembly and compact system layouts.
• Power Supply Core voltage supply range of 0.95 V to 1.05 V to match targeted power rails.
• Operating Range and Grade Commercial grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance RoHS compliant for restriction of hazardous substances in assembly.

Typical Applications

• High-density digital processing — Implement large combinational and sequential logic blocks using the device's ~155,648 logic elements and embedded RAM to handle complex algorithms on-chip.
• Large I/O systems — Integrate parallel interfaces, board-level I/O expansion and multi-channel connectivity leveraging up to 640 user I/O pins.
• Custom hardware acceleration — Deploy reconfigurable accelerators and datapaths that benefit from substantial on-chip logic and approximately 7.8 Mbits of embedded memory.

Unique Advantages

• High on-chip capacity: The large logic element count enables implementation of wide datapaths and sizable custom logic without immediately relying on external components.
• Significant embedded memory: Approximately 7.8 Mbits of RAM reduces dependence on external memory for buffering and local storage, simplifying board design.
• Extensive I/O: 640 I/O pins provide flexibility for connecting multiple peripherals, parallel buses or high-channel-count interfaces.
• Compact BGA package: The 1136-FCBGA (35×35 mm) package offers a dense footprint for space-constrained systems while supporting surface-mount assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match a wide range of standard electronic products.
• RoHS compliant: Meets environmental material restrictions for modern assembly processes.

Why Choose XC5VLX155T-1FFG1136C?

The XC5VLX155T-1FFG1136C positions itself as a high-capacity, commercially graded Virtex-5 LXT FPGA tailored for designs that need substantial logic resources, on-chip memory and broad I/O bandwidth in a single surface-mount package. Its combination of approximately 155,648 logic elements, about 7.8 Mbits of embedded RAM and 640 user I/Os makes it appropriate for projects requiring dense integration and reduced external component count.

Manufactured by AMD and supplied in a 1136-ball FCBGA package, this device is a practical choice for engineering teams focused on scalable, board-level FPGA implementations within commercial operating conditions.

Request a quote or submit an inquiry to obtain pricing, lead-time and availability for the XC5VLX155T-1FFG1136C.