XC5VLX155T-1FFG1738I

The XC5VLX155T-1FFG1738I is a Virtex®-5 LXT field programmable gate array (FPGA) device designed for high-density, high-I/O programmable logic applications. It provides substantial on-chip logic and memory capacity alongside a large I/O complement for designs that require extensive connectivity and embedded resources.

This industrial-grade, surface-mount FPGA supports a core supply range of 950 mV to 1.05 V and an operating temperature range of −40 °C to 100 °C, and is available in a 1738-ball FCBGA package (42.5 × 42.5 mm).

Key Features

• Configurable Logic Approximately 155,648 logic elements to implement large-scale digital logic and state machines.
• Embedded Memory Approximately 7.8 Mbits of on-chip RAM for buffering, lookup tables, and local storage.
• High I/O Count 680 user I/O pins to support wide parallel interfaces and extensive peripheral connectivity.
• Power Core supply voltage range from 950 mV to 1.05 V to match system power-rail requirements.
• Package and Mounting 1738-ball FCBGA package (1738-FCBGA, 42.5 × 42.5 mm), surface-mount mounting for compact board-level integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High-density interface bridging — The 680 I/O pins enable implementation of wide parallel interfaces and multiple simultaneous links on a single device.
• Large-scale logic implementation — With approximately 155,648 logic elements, the device supports complex state machines, protocol engines, and custom processing pipelines.
• On-chip buffering and LUT storage — Approximately 7.8 Mbits of embedded RAM provides local memory for buffering, FIFOs, and lookup tables.

Unique Advantages

• Substantial logic capacity: Approximately 155,648 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Extensive I/O resources: 680 I/Os support high-pin-count interfaces without external glue logic, simplifying system routing and partitioning.
• Embedded memory on-chip: Approximately 7.8 Mbits of RAM reduces dependence on external memory for many buffering and LUT needs.
• Industrial temperature range: Rated operation from −40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
• Compact FCBGA packaging: The 1738-ball FCBGA (42.5 × 42.5 mm) offers high density in a surface-mount form factor suitable for production assemblies.
• RoHS compliant: Meets common environmental compliance expectations for manufactured electronics.

Why Choose XC5VLX155T-1FFG1738I?

The XC5VLX155T-1FFG1738I balances high logic capacity, sizable embedded memory, and a large I/O complement in a single industrial-grade FPGA package. It is positioned for designs that require dense programmable logic, significant on-chip RAM, and broad connectivity while meeting extended temperature requirements.

This device is appropriate for teams and products needing scalable, integrated programmable logic resources with a compact FCBGA footprint and supply-voltage compatibility between 950 mV and 1.05 V, offering long-term value through consolidation of multiple functions into one FPGA.

Request a quote or submit a sales inquiry to obtain pricing, availability, and lifecycle information for the XC5VLX155T-1FFG1738I.