XC5VLX155T-2FF1738C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 7815168 155648 1738-BBGA, FCBGA |
|---|---|
| Quantity | 378 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 680 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX155T-2FF1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA), 1738-FCBGA
The XC5VLX155T-2FF1738C is a Virtex‑5 LXT field programmable gate array (FPGA) from AMD supplied in a 1738‑ball FCBGA package (42.5 × 42.5 mm). It is a commercial‑grade, surface‑mount FPGA designed to deliver large logic capacity alongside extensive on‑chip memory and I/O resources.
With 155,648 logic elements, approximately 7.8 Mbits of embedded memory and 680 I/Os, this device is targeted at designs that require high integration of digital logic, substantial internal RAM, and broad external interfacing while operating within standard commercial temperature and supply ranges.
Key Features
- Core Logic Capacity 155,648 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory Approximately 7.8 Mbits of on‑chip RAM to support data buffering, large state machines and memory‑heavy logic without immediate reliance on external memory.
- High I/O Count 680 general‑purpose I/O pins to accommodate dense external interfaces and parallel connectivity requirements.
- Power Supply Core voltage supply range of 0.95 V to 1.05 V to match system power rails and ensure predictable core operation.
- Package & Mounting 1738‑FBG A FCBGA package (42.5 × 42.5 mm) in a surface‑mount form factor for high‑density PCB layouts.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for standard commercial applications.
- Environmental Compliance RoHS compliant to support regulatory and environmental requirements for commercial electronics.
Typical Applications
- High‑density logic implementations Complex digital designs that require large amounts of programmable logic capacity and sophisticated control logic.
- Memory‑intensive designs Applications that benefit from significant on‑chip RAM for buffering, packet processing or state storage.
- High‑pin count interfacing Systems needing broad external connectivity or parallel data interfaces leveraging the 680 I/O pins.
- Prototyping and development platforms FPGA‑based development where a commercial‑grade, high‑capacity device is required for system validation and proof‑of‑concepts.
Unique Advantages
- Large integrated logic capacity: 155,648 logic elements reduce the need for multiple devices and simplify partitioning of large designs.
- Substantial on‑chip memory: Approximately 7.8 Mbits of embedded RAM lowers dependency on external memory and shortens data paths.
- Extensive I/O resources: 680 I/Os enable direct connection to many peripherals and high‑bandwidth external interfaces.
- Compact, high‑density package: The 1738‑FCBGA (42.5 × 42.5 mm) package supports high integration on space‑constrained PCBs.
- Commercial‑grade robustness: Designed for 0 °C to 85 °C operation with RoHS compliance for mainstream electronics deployments.
Why Choose XC5VLX155T-2FF1738C?
The XC5VLX155T-2FF1738C positions itself as a high‑capacity, commercial‑grade FPGA offering a balance of extensive logic resources, on‑chip memory and a large I/O count in a compact FCBGA package. It is well suited to engineers and OEMs who need to integrate substantial digital functionality and broad external interfacing within standard commercial temperature and power limits.
As an AMD Virtex‑5 LXT device, this FPGA supports designs that demand scalability of logic and memory resources while maintaining predictable power and thermal characteristics for commercial applications.
Request a quote or submit an inquiry for availability and pricing of the XC5VLX155T-2FF1738C to move your design forward.

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