XC5VLX155T-2FFG1738C
| Part Description |
Virtex®-5 LXT Field Programmable Gate Array (FPGA) IC 680 7815168 155648 1738-BBGA, FCBGA |
|---|---|
| Quantity | 109 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1738-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1738-BBGA, FCBGA | Number of I/O | 680 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12160 | Number of Logic Elements/Cells | 155648 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7815168 |
Overview of XC5VLX155T-2FFG1738C – Virtex®-5 LXT Field Programmable Gate Array (FPGA), 155,648 logic elements
The XC5VLX155T-2FFG1738C is a Virtex®-5 LXT series Field Programmable Gate Array (FPGA) from AMD configured in a 1738-ball FCBGA package. It provides a high logic capacity device with a substantial embedded memory complement and extensive I/O, suited for high-density programmable logic designs.
With 155,648 logic elements, approximately 7.8 Mbits of embedded memory and 680 available I/O, this device is positioned for complex digital designs that require significant on-chip resources and a compact surface-mount package.
Key Features
- Core Logic Capacity 155,648 logic elements provide a large fabric for implementing complex RTL and custom logic functions.
- Embedded Memory Approximately 7.8 Mbits of total on-chip RAM to support buffering, state storage and local data processing.
- High I/O Count 680 user I/O pins to enable broad external connectivity and multi-channel interfacing.
- Package & Mounting 1738-ball FCBGA package (1738-FCBGA, 42.5 × 42.5 mm) in a surface-mount form factor for dense board-level integration.
- Power Core supply range specified at 0.95 V to 1.05 V to match system power design requirements.
- Operating Range & Grade Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant.
Typical Applications
- High-density programmable logic systems Implement large-scale custom logic and processing pipelines that require extensive LUT and flip-flop resources.
- Data buffering and memory-intensive functions Use the approximately 7.8 Mbits of on-chip RAM for local buffering, FIFOs and embedded storage to reduce external memory dependence.
- Multi-channel I/O and interface aggregation Leverage 680 I/O pins to consolidate multiple interfaces and sensors on a single FPGA platform.
Unique Advantages
- Large programmable fabric: 155,648 logic elements enable implementation of expansive custom logic and parallel processing architectures.
- Substantial on-chip memory: Approximately 7.8 Mbits of embedded RAM supports data-intensive functions without immediate reliance on external memory.
- Extensive I/O resources: 680 I/O pins provide flexibility for multi-channel interfacing and complex board-level connectivity.
- Compact FCBGA packaging: The 1738-ball FCBGA (42.5 × 42.5 mm) surface-mount package allows high-density PCB placement while accommodating the device’s high pin count.
- Defined power and thermal parameters: Core voltage range of 0.95–1.05 V and a commercial operating range of 0 °C to 85 °C enable straightforward system-level planning.
- RoHS compliant: Meets environmental compliance requirements for lead-free assemblies.
Why Choose XC5VLX155T-2FFG1738C?
The XC5VLX155T-2FFG1738C combines a large logic element count, meaningful embedded memory and a high I/O complement in a single FCBGA package, providing a compact yet capable platform for demanding programmable logic designs. Its defined supply and temperature ranges make it suitable for commercial electronic applications where on-chip capacity and interface density are primary requirements.
Designed as part of the Virtex®-5 LXT family from AMD, this device is appropriate for engineering teams seeking to consolidate functionality, reduce external component count, and scale complex digital systems within a surface-mount footprint.
If you would like pricing, availability or to request a quote for the XC5VLX155T-2FFG1738C, submit an inquiry or request a quote and our team will respond with details tailored to your purchasing needs.

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